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TDA8953TH/N1,112

NXP Semiconductors

TDA8953TH/N1,112 by NXP Semiconductors

NXP's TDA8953TH/N1,112 is a dual-function audio amplifier IC with +-41V power supplies. It features 24 terminals in a small outline package suitable for industrial applications. With peak reflow temp of 225°C, it operates b/w -40 to 85°C, making it ideal for audio and video amplification needs.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,790 parts In-Stock

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Anansix

USA . 1,514 parts In-Stock

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1,514

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Digiode

USA . 1,000 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Cogito LLC

Ukraine . 3 parts In-Stock

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Modulus Dynamics

Lithuania . 3,849 parts In-Stock

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$0.265

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$0.265

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$0.265

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3,849

$0.265

$0.265

$0.265

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Corohmni

South Africa . 5 parts In-Stock

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$3.147

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Microchip USA

USA . 361 parts In-Stock

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$5.556

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361

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AZTECH Wire

Italy . 956 parts In-Stock

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$14.980

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956

$14.980

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Ampacity Inc.

Singapore . 1,464 parts In-Stock

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$21.800

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$21.800

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One Stop Electronics

USA . 888 parts In-Stock

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$21.800

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$21.800

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UNI Independent Distributors

Spain . 8,085 parts In-Stock

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Argo Parts USA

USA . 3,472 parts In-Stock

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Continental Prestige Electronics

USA . 2,170 parts In-Stock

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Perfect Parts

USA . 941 parts In-Stock

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Corphita

USA . 517 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Experience premium audio quality with the TDA8953TH/N1,112 by NXP Semiconductors. As a leader in the semiconductor industry, NXP delivers top-notch products like this audio amplifier that are perfect for a variety of applications. From home entertainment systems to professional audio equipment, this compact and efficient amplifier offers superior sound performance. With its advanced features and reliable design, the TDA8953TH/N1,112 provides exceptional value and benefits to customers looking for high-quality audio solutions. Elevate your audio experience with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to damage, ensuring longevity of the product.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into various electronic devices.

No. of Functions: 2

Having multiple functions in one component saves space and simplifies circuit design.

Package Shape: RECTANGULAR

The rectangular shape is compact and space-efficient, making it suitable for small electronic devices.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high-quality sound output.

Power Supplies (V): +-41

Supports a wide range of power supplies, making it versatile and compatible with various systems.

No. of Terminals: 24

Having 24 terminals allows for multiple connections and flexibility in the circuit layout.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature ranges, ensuring reliable performance in harsh environments.

Maximum Supply Current: 75 mA

Low supply current consumption helps in energy efficiency and prolonging battery life in portable devices.

Technical Specifications

Audio & Video Amplifiers TDA8953TH/N1,112 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.56,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

225

Power Supplies (V):

+-41

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

75 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

TDA8953TH/N1,112 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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