Loading...

TDA8922CTH/N1,118

NXP Semiconductors

TDA8922CTH/N1,118 by NXP Semiconductors

TDA8922CTH/N1,118 by NXP Semiconductors is a dual audio amplifier designed for industrial applications. It operates at ±30V with a max supply current of 75mA and functions in temperatures from -40 °C to 85 °C. Its compact SOIC package ensures efficient surface mounting.

Median Price

$1.967

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.967

10k+ parts

-

2,500

-

-

$1.967

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,164

-

-

-

-

Digiode

USA . 1,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,980

-

-

-

-

Anansix

USA . 716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

716

-

-

-

-

Bristol Electronics

USA . 353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

353

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,281 parts In-Stock

1+ parts

$5.403

100+ parts

-

1k+ parts

-

10k+ parts

-

2,281

$5.403

-

-

-

One Stop Electronics

USA . 941 parts In-Stock

1+ parts

$5.800

100+ parts

-

1k+ parts

-

10k+ parts

-

941

$5.800

-

-

-

AZTECH Wire

Italy . 878 parts In-Stock

1+ parts

$16.090

100+ parts

-

1k+ parts

-

10k+ parts

-

878

$16.090

-

-

-

UNI Independent Distributors

Spain . 4,348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,348

-

-

-

-

Perfect Parts

USA . 1,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,120

-

-

-

-

Corphita

USA . 1,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,091

-

-

-

-

Overview

Elevate your audio experience with the TDA8922CTH/N1,118 from NXP Semiconductors. Renowned for its unmatched quality and reliability, NXP brings you a dual-channel amplifier that delivers exceptional sound clarity and performance. Ideal for diverse applications—from home theater systems to professional audio equipment—this compact powerhouse offers robust efficiency and temperature resilience, ensuring lasting value for discerning customers who demand excellence in every note.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures lightweight yet durable construction, making it suitable for various applications in audio and video systems.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of PCB space, perfect for modern electronic devices.

No. of Functions: 2

With two functions, this amplifier can effectively manage multiple audio channels, enhancing flexibility in audio applications.

Package Shape: RECTANGULAR

The rectangular shape is optimized for efficient placement on PCB layouts, facilitating ease of integration in different designs.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, it is specifically designed to enhance sound quality, making it ideal for audio-focused applications.

Power Supplies (V): +-30

The wide voltage supply range allows for compatibility with a variety of power sources, enhancing versatility in applications.

No. of Terminals: 24

With 24 terminals, it provides ample connectivity options for complex audio circuits, ensuring robust performance.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline with shrink pitch allows for high-density mounting on PCBs, conserving space in compact devices.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability and performance in warm environments, suitable for demanding applications.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures makes this amplifier ideal for use in extreme conditions without compromising performance.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in design and layout, offering convenience in connection options.

Peak Reflow Temperature °C: 225

A peak reflow temperature of 225 °C indicates compatibility with modern soldering processes, ensuring reliability in assembly.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies robustness and the capability to operate consistently under harsh environmental conditions.

Terminal Form: GULL WING

Gull wing terminals provide secure solder joints, enhancing the reliability of the connections in electronic circuits.

Maximum Supply Current: 75 mA

The relatively low maximum supply current allows for efficient power usage, making this amplifier suitable for battery-operated devices.

Terminal Pitch: 1 mm

The 1 mm terminal pitch facilitates high-density interconnections, making it perfect for modern compact circuit designs.

Technical Specifications

Audio & Video Amplifiers TDA8922CTH/N1,118 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.56,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

225

Power Supplies (V):

+-30

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

75 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

TDA8922CTH/N1,118 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20