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TDA8922CTH/N1,112

NXP Semiconductors

TDA8922CTH/N1,112 by NXP Semiconductors

TDA8922CTH/N1,112 by NXP Semiconductors is a dual audio amplifier designed for industrial applications. It operates at ±30V with a max supply current of 75mA and supports temperatures from -40 °C to 85 °C. Its compact SMD package ensures efficient integration in audio systems.

Median Price

$2.720

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15 parts In-Stock

1+ parts

-

100+ parts

$2.720

1k+ parts

$2.430

10k+ parts

$2.290

15

-

$2.720

$2.430

$2.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,682 parts In-Stock

1+ parts

$2.878

100+ parts

-

1k+ parts

-

10k+ parts

-

2,682

$2.878

-

-

-

Vyrian

USA . 3,594 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,594

-

-

-

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Anansix

USA . 722 parts In-Stock

1+ parts

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1k+ parts

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722

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 421 parts In-Stock

1+ parts

$2.727

100+ parts

-

1k+ parts

-

10k+ parts

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421

$2.727

-

-

-

Microchip USA

USA . 304 parts In-Stock

1+ parts

$5.724

100+ parts

-

1k+ parts

-

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304

$5.724

-

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AZTECH Wire

Italy . 1,051 parts In-Stock

1+ parts

$12.240

100+ parts

-

1k+ parts

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10k+ parts

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1,051

$12.240

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 2,885 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,885

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UNI Independent Distributors

Spain . 1,112 parts In-Stock

1+ parts

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1,112

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Overview

Elevate your audio experience with the TDA8922CTH/N1,112 from NXP Semiconductors, a leader in cutting-edge technology. This high-quality audio amplifier ensures crystal-clear sound and robust performance, ideal for home entertainment systems, automotive applications, and portable devices. With its compact design and industrial-grade reliability, you gain unmatched value, efficiency, and the trust of a renowned manufacturer dedicated to innovation and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for easier integration into modern compact designs and automated assembly processes.

No. of Functions: 2

With two functions available, this amplifier offers versatility, allowing designers to optimize circuit design and space.

Package Shape: RECTANGULAR

The rectangular package shape is designed for efficient layout and space management on PCBs, facilitating easier design.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, it is specifically tailored for high-quality sound reproduction, making it ideal for audio applications.

Power Supplies (V): +-30

The ability to operate at ±30V makes this amplifier suitable for high-power audio applications, enabling it to drive larger speakers.

No. of Terminals: 24

With 24 terminals, this amplifier provides a rich set of connectivity options, allowing for complex circuitry and functionality.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline, shrink pitch style minimizes the overall footprint on the PCB, enabling compact design and efficient space usage.

Maximum Operating Temperature: 85 °C

Operating at a maximum of 85 °C ensures reliability in high-temperature environments, making it suitable for industrial and audio applications.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 °C provides robust performance in extreme conditions, enhancing its application versatility.

Terminal Position: DUAL

Dual terminal positioning simplifies routing and connection on the PCB, making it easier for designers to implement.

Peak Reflow Temperature: 225 °C

A peak reflow temperature of 225 °C is compatible with standard soldering processes, ensuring reliability during manufacturing.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates reliability and performance in harsh environments, suitable for demanding applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and strong mechanical connections, enhancing the robustness of the assembly.

Maximum Supply Current: 75 mA

A maximum supply current of 75 mA enables it to provide ample power for audio applications without excessive power consumption.

Terminal Pitch: 1 mm

The 1 mm terminal pitch allows for compact layouts and efficient use of PCB space, important for modern electronics.

Technical Specifications

Audio & Video Amplifiers TDA8922CTH/N1,112 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.56,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

225

Power Supplies (V):

+-30

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

75 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

TDA8922CTH/N1,112 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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