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TDA8559T/N1,518

NXP Semiconductors

TDA8559T/N1,518 by NXP Semiconductors

NXP Semiconductors' TDA8559T/N1,518 is a 16-terminal audio amplifier IC with 2 channels and 26 dB gain. Operating b/w -40 to 150°C, it offers 0.035 W output power at 0.75 kHz bandwidth. Ideal for automotive applications, this small outline package IC has a low harmonic distortion of 10%.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 4,930 parts In-Stock

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Digiode

USA . 935 parts In-Stock

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Anansix

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Nova Conductors

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One Stop Electronics

USA . 1,105 parts In-Stock

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$14.800

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AZTECH Wire

Italy . 447 parts In-Stock

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$15.541

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QUARKTWIN TECHNOLOGY LTD

USA . 12,291 parts In-Stock

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Microchip USA

USA . 7,318 parts In-Stock

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UNI Independent Distributors

Spain . 6,416 parts In-Stock

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Corphita

USA . 1,114 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Elevate your audio experience with the NXP Semiconductors TDA8559T/N1,518 Audio Amplifier. Crafted with precision and expertise, this small outline package offers top-notch quality and reliability for your audio and video amplification needs. Whether you're enhancing your car stereo system or upgrading your home entertainment setup, this amplifier delivers clear, powerful sound with minimal distortion. Trust NXP Semiconductors to provide superior performance and value in every product they create. Experience the difference today with the TDA8559T/N1,518.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the amplifier.

Surface Mount: YES

Being surface mountable allows for easier and more convenient installation of the amplifier on circuit boards.

Harmonic Distortion: 10%

Low harmonic distortion ensures that the audio output from the amplifier is clean and high-quality.

Nominal Output Power: 0.035 W

Despite its small size, this amplifier still provides a decent output power for audio amplification.

Nominal Bandwidth: 0.75 kHz

The nominal bandwidth of 0.75 kHz ensures that a wide range of audio frequencies can be accurately reproduced by the amplifier.

Technical Specifications

Audio & Video Amplifiers TDA8559T/N1,518 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

Nominal Bandwidth:

.75 kHz

General IC Type:

Gain:

26 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Terminals:

16

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.035 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

4 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TDA8559T/N1,518 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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