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SSTU32864EC

NXP Semiconductors

SSTU32864EC by NXP Semiconductors

D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

Median Price

$10.311

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 1,911 parts In-Stock

1+ parts

$10.311

100+ parts

$10.827

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$10.208

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1,911

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$10.827

$10.208

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Digiode

USA . 7,947 parts In-Stock

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Vyrian

USA . 2,344 parts In-Stock

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2,344

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Anansix

USA . 905 parts In-Stock

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905

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Distributors (Availability)

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Parana Technologies

USA . 2,351 parts In-Stock

1+ parts

$9.316

100+ parts

-

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$9.940

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2,351

$9.316

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$9.940

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DigiPath Technology Company

USA . 1,928 parts In-Stock

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$10.258

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$9.437

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1,928

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ChromeModa Solutions

Germany . 1,105 parts In-Stock

1+ parts

$10.467

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$8.583

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$10.467

$8.583

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IDEA Electronic Components Group

UK . 964 parts In-Stock

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$10.467

100+ parts

$9.944

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$9.420

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964

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$9.944

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AZTECH Wire

Italy . 436 parts In-Stock

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$14.532

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436

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One Stop Electronics

USA . 2,014 parts In-Stock

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$36.000

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Perfect Parts

USA . 1,821 parts In-Stock

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UNI Independent Distributors

Spain . 725 parts In-Stock

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Corphita

USA . 549 parts In-Stock

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549

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Technical Specifications

Latches & Flip-Flops SSTU32864EC attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Additional Features:

14 BIT 1:2 CONFIGURATION ALSO POSSIBLE

Family:

SSTU

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Logic IC Type:

No. of Bits:

25

No. of Functions:

1

No. of Terminals:

96

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8

Propagation Delay (tpd):

2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trigger Type:

POSITIVE EDGE

Width:

5.5 mm

Minimum fmax:

450 MHz

Trade Compliance

SSTU32864EC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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