Loading...

SSTU32865ET/G,518

NXP Semiconductors

SSTU32865ET/G,518 by NXP Semiconductors

D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 160; Package Code: TFBGA; Package Shape: RECTANGULAR;

Median Price

$3.025

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$2.710

1k+ parts

$2.420

10k+ parts

$2.280

6,000

-

$2.710

$2.420

$2.280

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

-

10k+ parts

-

6,000

-

$3.130

-

-

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.025

10k+ parts

$2.850

6,000

-

-

$3.025

$2.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,513 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

-

10k+ parts

-

4,513

$2.860

-

-

-

Vyrian

USA . 4,345 parts In-Stock

1+ parts

$3.010

100+ parts

-

1k+ parts

-

10k+ parts

-

4,345

$3.010

-

-

-

Anansix

USA . 166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

166

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,253 parts In-Stock

1+ parts

$2.709

100+ parts

-

1k+ parts

-

10k+ parts

-

4,253

$2.709

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,366

-

-

-

-

Microchip USA

USA . 5,778 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,778

-

-

-

-

UNI Independent Distributors

Spain . 2,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,358

-

-

-

-

Technical Specifications

Latches & Flip-Flops SSTU32865ET/G,518 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

SSTU

JESD-30 Code:

R-PBGA-B160

Length:

13 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Bits:

28

No. of Functions:

1

No. of Terminals:

160

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-DRAIN

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Propagation Delay (tpd):

2.15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Trigger Type:

POSITIVE EDGE

Width:

9 mm

Minimum fmax:

270 MHz

Trade Compliance

SSTU32865ET/G,518 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19