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SPC5746BK1MMJ6

NXP Semiconductors

SPC5746BK1MMJ6 by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

Median Price

$17.620

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,150 parts In-Stock

1+ parts

-

100+ parts

$17.620

1k+ parts

$15.770

10k+ parts

$14.840

3,150

-

$17.620

$15.770

$14.840

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,844 parts In-Stock

1+ parts

$18.601

100+ parts

-

1k+ parts

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3,844

$18.601

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Vyrian

USA . 3,096 parts In-Stock

1+ parts

-

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3,096

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Anansix

USA . 238 parts In-Stock

1+ parts

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238

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 569 parts In-Stock

1+ parts

$15.680

100+ parts

-

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569

$15.680

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Corphita

USA . 809 parts In-Stock

1+ parts

$17.622

100+ parts

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809

$17.622

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Component Stockers USA

USA . 854 parts In-Stock

1+ parts

$30.080

100+ parts

$28.270

1k+ parts

$25.570

10k+ parts

-

854

$30.080

$28.270

$25.570

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Vigor

Singapore . 2,272 parts In-Stock

1+ parts

$37.648

100+ parts

-

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2,272

$37.648

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Microchip USA

USA . 2,834 parts In-Stock

1+ parts

$49.592

100+ parts

-

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2,834

$49.592

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QUARKTWIN TECHNOLOGY LTD

USA . 15,881 parts In-Stock

1+ parts

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15,881

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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UNI Independent Distributors

Spain . 648 parts In-Stock

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648

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Technical Specifications

Microcontrollers SPC5746BK1MMJ6 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

1

No. of I/O Lines:

178

No. of Terminals:

256

No. of Timers:

64

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

RAM Bytes:

393216

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

160 rpm

Maximum Supply Current:

264 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

65536

Connectivity:

DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4)

Peripherals:

ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT

Analog To Digital Convertors:

31-Ch 12-Bit, 68-Ch 10-Bit

Trade Compliance

SPC5746BK1MMJ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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