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SPC5744BK1CMH2

NXP Semiconductors

SPC5744BK1CMH2 by NXP Semiconductors

NXP Semiconductors' SPC5744BK1CMH2 microcontroller features 32-bit CPU, 196608 bytes RAM, and 1572864 ROM words. Ideal for industrial applications with ISO 26262 screening level, it offers 31-Ch 12-Bit ADC channels and low power mode for efficient performance at a max clock frequency of 40 MHz.

Median Price

$10.760

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,760 parts In-Stock

1+ parts

-

100+ parts

$10.760

1k+ parts

$9.630

10k+ parts

$9.060

1,760

-

$10.760

$9.630

$9.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 547 parts In-Stock

1+ parts

$11.362

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547

$11.362

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Vyrian

USA . 5,593 parts In-Stock

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5,593

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Anansix

USA . 1,949 parts In-Stock

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1,949

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Nova Conductors

Japan . 72 parts In-Stock

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72

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,604 parts In-Stock

1+ parts

$10.170

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1,604

$10.170

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Semicontronic

India . 1,299 parts In-Stock

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$10.170

100+ parts

$9.916

1k+ parts

$9.865

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-

1,299

$10.170

$9.916

$9.865

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Corphita

USA . 119 parts In-Stock

1+ parts

$10.764

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119

$10.764

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AZTECH Wire

Italy . 1,131 parts In-Stock

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$11.990

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$11.990

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Corohmni

South Africa . 269 parts In-Stock

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$12.592

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269

$12.592

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Vigor

Singapore . 4,806 parts In-Stock

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$22.990

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$22.990

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Microchip USA

USA . 2,293 parts In-Stock

1+ parts

$39.817

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$39.817

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Aztec Data Supply Inc.

USA . 4,975 parts In-Stock

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$82.001

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$82.001

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Continental Prestige Electronics

USA . 6,882 parts In-Stock

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UNI Independent Distributors

Spain . 6,385 parts In-Stock

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Argo Parts USA

USA . 3,202 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Elevate your projects with the SPC5744BK1CMH2 by NXP Semiconductors, a cutting-edge microcontroller that delivers top-notch performance and reliability. Crafted by the trusted manufacturer, NXP Semiconductors, this device is designed to meet the highest industry standards, making it ideal for a wide range of applications. With advanced features like integrated cache and low power mode, this microcontroller offers unparalleled value and benefits to customers looking to streamline their designs and boost efficiency. Experience the difference with the SPC5744BK1CMH2 and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a durable and lightweight housing for the microcontroller, making it suitable for various applications.

Integrated Cache: YES

The integrated cache helps improve processing speed and efficiency, making this microcontroller an excellent choice for tasks that require quick data access.

Surface Mount: YES

The surface mount feature allows for easy and secure PCB mounting, enhancing the overall reliability of the product.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage ensures stable and consistent performance, making this microcontroller a reliable choice for demanding applications.

On Chip Data RAM Width: 8

The wide data RAM width allows for efficient data processing and storage, making this microcontroller suitable for handling complex tasks.

Screening Level: ISO 26262

The ISO 26262 screening level indicates that this microcontroller meets strict automotive safety standards, making it a reliable choice for automotive applications.

Package Shape: SQUARE

The square package shape offers a compact and space-saving design, making this microcontroller suitable for applications with limited space.

Bit Size: 32

The 32-bit architecture enables fast and efficient processing, making this microcontroller a powerful choice for high-performance applications.

No. of Terminals: 100

The large number of terminals allows for versatile connectivity options, making this microcontroller suitable for a wide range of applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The low profile grid array package style offers a compact and durable housing, making this microcontroller suitable for applications with space constraints.

Technical Specifications

Microcontrollers SPC5744BK1CMH2 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

1

No. of I/O Lines:

65

No. of Terminals:

100

No. of Timers:

64

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

RAM Bytes:

196608

ROM Words:

1572864

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.41 mm

Speed:

120 rpm

Maximum Supply Current:

264 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Data EEPROM Size:

65536

Connectivity:

DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4)

Peripherals:

ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT

Analog To Digital Convertors:

31-Ch 12-Bit, 68-Ch 10-Bit

Trade Compliance

SPC5744BK1CMH2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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