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SPC5607BK0MLL6

NXP Semiconductors

SPC5607BK0MLL6 by NXP Semiconductors

NXP Semiconductors' SPC5607BK0MLL6 is a 32-bit microcontroller with 100 terminals, operating at a max clock frequency of 16 MHz. It features ADC and DMA channels, suitable for applications requiring PWM control and peripheral IC interfacing. The compact square package with low profile design makes it ideal for space-constrained projects.

Median Price

$15.020

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 288 parts In-Stock

1+ parts

-

100+ parts

$15.020

1k+ parts

$13.440

10k+ parts

$12.650

288

-

$15.020

$13.440

$12.650

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,884 parts In-Stock

1+ parts

$15.856

100+ parts

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4,884

$15.856

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Vyrian

USA . 6,385 parts In-Stock

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6,385

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Anansix

USA . 2,528 parts In-Stock

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2,528

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Nova Conductors

Japan . 19 parts In-Stock

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19

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Distributors (Availability)

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AZTECH Wire

Italy . 799 parts In-Stock

1+ parts

$7.736

100+ parts

-

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799

$7.736

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Ampacity Inc.

Singapore . 260 parts In-Stock

1+ parts

$14.190

100+ parts

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260

$14.190

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Corphita

USA . 4,650 parts In-Stock

1+ parts

$15.021

100+ parts

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4,650

$15.021

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Vigor

Singapore . 2,347 parts In-Stock

1+ parts

$25.820

100+ parts

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2,347

$25.820

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Microchip USA

USA . 2,596 parts In-Stock

1+ parts

$50.005

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2,596

$50.005

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UNI Independent Distributors

Spain . 7,227 parts In-Stock

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Argo Parts USA

USA . 3,486 parts In-Stock

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Continental Prestige Electronics

USA . 2,015 parts In-Stock

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2,015

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock endless possibilities and streamline your projects with the SPC5607BK0MLL6 by NXP Semiconductors. As a trusted industry leader, NXP delivers top-quality microcontrollers that are perfect for a wide range of applications. From automotive to industrial automation, this versatile device offers unmatched performance and reliability. Say goodbye to limitations and hello to innovation with the SPC5607BK0MLL6.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto a circuit board, saving time and labor costs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, providing flexibility in design and usage.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the circuit board, allowing for compact and sleek designs.

Bit Size: 32

A 32-bit architecture provides high processing power and enables complex operations and calculations to be performed efficiently.

No. of Terminals: 100

Having a high number of terminals allows for versatile connectivity options, making it suitable for a wide range of applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers a compact footprint and improves signal integrity, enhancing overall performance.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage ensures compatibility with a variety of power sources while maintaining stable operation.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, facilitating easy and reliable soldering during assembly.

ADC Channels: YES

Integrated ADC channels enable analog-to-digital conversion, allowing the microcontroller to interface with sensors and other analog devices.

DMA Channels: YES

Direct Memory Access (DMA) channels enhance data transfer efficiency and reduce CPU workload, improving overall system performance.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure placement onto the circuit board, ensuring reliable connections and minimizing signal interference.

Width: 14 mm

The compact width of 14mm makes this microcontroller suitable for space-constrained applications without compromising on functionality.

Maximum Clock Frequency: 16 MHz

A high maximum clock frequency of 16 MHz allows for fast data processing and real-time operation, enhancing system performance.

Maximum Time At Peak Reflow Temperature (s): 40

The microcontroller can withstand peak reflow temperatures for up to 40 seconds, ensuring robust solder joints and reliable assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this microcontroller can withstand high-temperature soldering processes, ensuring durability and reliability.

Length: 14 mm

The compact length of 14mm contributes to the overall space-efficient design of the microcontroller, making it suitable for small form factor applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers simplified instruction set and high performance, making it ideal for embedded systems requiring fast processing speeds.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical connections and facilitates easy PCB mounting, ensuring reliable performance in various operating conditions.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems seamless.

PWM Channels: YES

Pulse Width Modulation (PWM) channels provide precise control over analog signals, enabling the microcontroller to interface with a variety of devices such as motors and LEDs.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for dense packing and precise connections, contributing to the overall reliability and performance of the microcontroller.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microcontroller has moderate sensitivity to moisture, requiring appropriate handling and storage conditions to prevent damage during assembly.

Speed: 64 rpm

With a speed of 64 rpm, this microcontroller can perform rapid data processing and control tasks, making it suitable for applications that require quick response times.

No. of I/O Lines: 77

A high number of I/O lines provide ample connectivity options for interfacing with external devices, enabling versatile functionality and customization.

Technical Specifications

Microcontrollers SPC5607BK0MLL6 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

77

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC5607BK0MLL6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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