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SPC5605BK0VLL4

NXP Semiconductors

SPC5605BK0VLL4 by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

Median Price

$11.205

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,170 parts In-Stock

1+ parts

$9.520

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-

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2,170

$9.520

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Verical

USA . 2,170 parts In-Stock

1+ parts

$9.520

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-

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2,170

$9.520

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Mouser Electronics

USA . 90 parts In-Stock

1+ parts

$12.890

100+ parts

$12.430

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-

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90

$12.890

$12.430

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Chip1Stop

Japan . 2,170 parts In-Stock

1+ parts

$21.927

100+ parts

$12.813

1k+ parts

$12.622

10k+ parts

-

2,170

$21.927

$12.813

$12.622

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Flip Electronics (Authorized)

USA . 3,967 parts In-Stock

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3,967

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Distributors (In-Stock)

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Digiode

USA . 1,628 parts In-Stock

1+ parts

$13.299

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1,628

$13.299

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Cyclops Electronics Ltd

UK . 7,246 parts In-Stock

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Vyrian

USA . 4,607 parts In-Stock

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4,607

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Flip Electronics

USA . 3,967 parts In-Stock

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Anansix

USA . 2,560 parts In-Stock

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2,560

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 302 parts In-Stock

1+ parts

$12.599

100+ parts

-

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302

$12.599

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Vigor

Singapore . 9,305 parts In-Stock

1+ parts

$20.460

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9,305

$20.460

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QUARKTWIN TECHNOLOGY LTD

USA . 25,834 parts In-Stock

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25,834

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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A-Z Elektronik GmbH

Germany . 4,838 parts In-Stock

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4,838

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Microchip USA

USA . 3,629 parts In-Stock

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3,629

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UNI Independent Distributors

Spain . 3,163 parts In-Stock

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3,163

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Kepictronics

USA . 1,252 parts In-Stock

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1,252

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Technical Specifications

Microcontrollers SPC5605BK0VLL4 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO HAVING 19-CH SHARED ADC AND OPERATES AT 5V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

77

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC5605BK0VLL4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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