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SPC5604PEF1MLL4

NXP Semiconductors

SPC5604PEF1MLL4 by NXP Semiconductors

NXP Semiconductors' SPC5604PEF1MLL4 microcontroller features 32-bit architecture, 40 MHz clock frequency, and 68 I/O lines. Ideal for applications requiring ADC and PWM channels, with a supply voltage range of 3-3.6V. Suitable for surface mount assembly in various electronic systems.

Median Price

$11.661

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$11.661

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100

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Vyrian

USA . 8,178 parts In-Stock

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Anansix

USA . 2,375 parts In-Stock

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Digiode

USA . 1,390 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$11.428

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$10.971

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Continental Prestige Electronics

USA . 1,692 parts In-Stock

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AZTECH Wire

Italy . 527 parts In-Stock

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$16.509

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527

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Vigor

Singapore . 2,095 parts In-Stock

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$17.130

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Ampacity Inc.

Singapore . 181 parts In-Stock

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$27.000

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One Stop Electronics

USA . 408 parts In-Stock

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Microchip USA

USA . 2,967 parts In-Stock

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Argo Parts USA

USA . 4,258 parts In-Stock

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Corphita

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UNI Independent Distributors

Spain . 1,858 parts In-Stock

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Overview

Unlock the full potential of your next project with the SPC5604PEF1MLL4 microcontroller by NXP Semiconductors. Designed with precision and reliability in mind, this innovative product offers a wide range of applications in industries such as automotive, consumer electronics, and industrial automation. With advanced features like ADC and DMA channels, PWM capabilities, and a maximum clock frequency of 40 MHz, this microcontroller provides unmatched performance and efficiency. Trust NXP Semiconductors to deliver cutting-edge technology that empowers you to bring your ideas to life.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient integration onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Provides a wide operating voltage range, making the microcontroller suitable for a variety of applications.

Package Shape: SQUARE

Space-saving design allows for efficient layout on PCB.

Bit Size: 32

Offers high computational power for processing data and executing instructions.

No. of Terminals: 100

Sufficient number of terminals for connecting various components and peripherals.

Package Style (Meter): FLATPACK

Compact and sturdy package style suitable for modern electronic devices.

Minimum Supply Voltage: 3 V

Allows for operation at lower voltages, increasing energy efficiency.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Allows for analog-to-digital conversion, essential for interfacing with analog sensors and signals.

DMA Channels: YES

Supports Direct Memory Access for data transfer between peripherals and memory, enhancing performance.

Terminal Position: QUAD

Quad position terminals offer good stability and contact reliability.

Width: 14 mm

Compact width enables integration in space-constrained designs.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering during manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature for secure and robust solder joints.

Length: 14 mm

Compact length for versatile mounting options in different devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance with reduced power consumption.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and solder joint reliability.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent operation of the microcontroller.

PWM Channels: YES

Supports Pulse-Width Modulation for precise control of output signals.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact layout and high-density board designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates good resistance to moisture during storage and handling.

Speed: 40 rpm

Operates at high speed for efficient data processing and system performance.

No. of I/O Lines: 68

Sufficient I/O lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers SPC5604PEF1MLL4 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

68

No. of Terminals:

100

PWM Channels:

YES

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Speed:

40 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC5604PEF1MLL4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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