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SPC5604CAMLL6R

NXP Semiconductors

SPC5604CAMLL6R by NXP Semiconductors

NXP Semiconductors' SPC5604CAMLL6R is a 32-bit microcontroller with 100 terminals, operating at a max clock frequency of 8 MHz. It features ADC and PWM channels, suitable for applications requiring precise analog-to-digital conversion and pulse-width modulation control. The device's low profile flatpack package makes it ideal for compact electronic designs.

Median Price

$13.257

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 10,000 parts In-Stock

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$13.257

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Flip Electronics (Authorized)

USA . 1,000 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 79 parts In-Stock

1+ parts

$12.515

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79

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Vyrian

USA . 7,805 parts In-Stock

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Digiode

USA . 2,730 parts In-Stock

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Flip Electronics

USA . 1,000 parts In-Stock

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Anansix

USA . 500 parts In-Stock

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500

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Distributors (Availability)

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Vigor

Singapore . 1,358 parts In-Stock

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$19.940

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AZTECH Wire

Italy . 376 parts In-Stock

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$21.020

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Ampacity Inc.

Singapore . 778 parts In-Stock

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$30.000

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Advanced Electronics

New Zealand . 800 parts In-Stock

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$49.657

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$49.161

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$47.175

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$47.175

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Component Stockers USA

USA . 1,063 parts In-Stock

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$130.550

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Microchip USA

USA . 2,960 parts In-Stock

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UNI Independent Distributors

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Corphita

USA . 1,769 parts In-Stock

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Overview

Upgrade your devices with the cutting-edge SPC5604CAMLL6R microcontroller by NXP Semiconductors, a leader in semiconductor technology. Designed for various applications, this powerful 32-bit microcontroller offers high performance and reliability. With features like ADC channels, PWM channels, and a maximum clock frequency of 8 MHz, it provides unmatched value to customers seeking top-notch solutions. Experience seamless integration and superior functionality with the SPC5604CAMLL6R, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and convenient installation on PCBs, saving time and space.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing flexibility in application power requirements.

Package Shape: SQUARE

Square package shape is more compact and fits well in tight spaces on the PCB.

Bit Size: 32

32-bit processing capability offers faster and more efficient operations compared to lower bit sizes.

No. of Terminals: 100

Large number of terminals provide plenty of I/O options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style offers good thermal performance and reliability.

Minimum Supply Voltage: 4.5 V

Can handle lower voltage inputs, allowing for operation in a wider range of power supply scenarios.

Terminal Finish: TIN

Tin terminal finish ensures good conductivity and durability for reliable connections.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to read analog signals accurately.

Terminal Position: QUAD

Quad terminal position provides stable and secure mounting on the PCB.

Width: 14 mm

Compact width allows for efficient use of space on the PCB.

Maximum Clock Frequency: 8 MHz

High clock frequency allows for fast processing and execution of instructions.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures for a sufficient duration during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering and manufacturing processes.

Length: 14 mm

Compact length complements the square package shape, fitting well on the PCB.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient and optimized processing capabilities.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering and stability on the PCB.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage is commonly available, making it compatible with various power sources.

PWM Channels: YES

Pulse width modulation channels enable precise control of output signals.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact layout and efficient use of PCB space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the microcontroller can withstand moderate humidity levels during storage and operation.

Speed: 64 rpm

Operates at a speed of 64 rotations per minute, suitable for various applications.

No. of I/O Lines: 79

Plenty of I/O lines for interfacing with sensors, actuators, and other external devices.

Technical Specifications

Microcontrollers SPC5604CAMLL6R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

79

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC5604CAMLL6R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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