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SJA1105TEL

NXP Semiconductors

SJA1105TEL by NXP Semiconductors

SJA1105TEL by NXP Semiconductors is a telecom IC with 159 terminals in a low profile grid array package. Operating temperature range from -40 to 105°C, suitable for industrial applications. Features include 1.2V supply voltage, 0.8mm terminal pitch, and AEC-Q100 screening level.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 3,786 parts In-Stock

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Vyrian

USA . 3,610 parts In-Stock

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3,610

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Anansix

USA . 2,044 parts In-Stock

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Digiode

USA . 1,480 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Corohmni

South Africa . 48 parts In-Stock

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$13.078

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48

$13.078

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One Stop Electronics

USA . 816 parts In-Stock

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$158.000

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816

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Ampacity Inc.

Singapore . 148 parts In-Stock

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$871.000

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UNI Independent Distributors

Spain . 5,607 parts In-Stock

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Argo Parts USA

USA . 5,125 parts In-Stock

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Continental Prestige Electronics

USA . 3,279 parts In-Stock

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Corphita

USA . 2,426 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Elevate your telecom systems with the SJA1105TEL by NXP Semiconductors. Crafted with precision and expertise, this cutting-edge telecom interface IC offers unparalleled quality and reliability. From grid arrays to fine pitch packages, this versatile solution is tailored to meet all your connectivity needs. With a wide temperature range and top-notch terminal finish, the SJA1105TEL ensures optimal performance in any environment. Experience seamless communication and enhanced efficiency with this industry-leading product. Upgrade to the SJA1105TEL today and unlock a world of possibilities for your telecom applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Enables easy mounting onto circuit boards, saving space and simplifying assembly processes.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures high reliability and quality standards, suitable for automotive applications.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB and facilitates easy designing.

No. of Terminals: 159

A higher number of terminals offer more connectivity options and functionality.

Maximum Operating Temperature: 105 °C

High operating temperature range ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the device to operate in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

This finish provides good electrical conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and enhances thermal management.

Maximum Seated Height: 1.5 mm

Low profile design reduces overall system height and enables compact product designs.

Width: 12 mm

Compact width dimension helps in optimizing space on the PCB.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability during assembly processes.

Length: 12 mm

Square shape with equal length and width dimensions simplifies board layout and integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable performance in rugged operating environments.

Terminal Form: BALL

Ball terminal form offers good mechanical strength and reliability in various applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance and compatibility.

Nominal Supply Voltage: 1.2 V

Operates efficiently at low supply voltage, suitable for power-sensitive applications.

Terminal Pitch: 0.8 mm

Fine pitch terminal spacing allows for more terminals in a smaller area, increasing functionality.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures.

Technical Specifications

Other Function Telecom Interface ICs SJA1105TEL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B159

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

159

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Trade Compliance

SJA1105TEL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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