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SCF5250LAG100

NXP Semiconductors

SCF5250LAG100 by NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

Median Price

$19.965

Lifecycle Status

EOL

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 900 parts In-Stock

1+ parts

$5.827

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-

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900

$5.827

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Flip Electronics (Authorized)

USA . 1,800 parts In-Stock

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1,800

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Rochester

USA . 300 parts In-Stock

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$19.550

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$17.490

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$16.460

300

-

$19.550

$17.490

$16.460

DigiKey

USA . 300 parts In-Stock

1+ parts

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$25.730

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300

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$25.730

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Farnell

UK . 300 parts In-Stock

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$20.380

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300

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$20.380

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Distributors (In-Stock)

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Digiode

USA . 590 parts In-Stock

1+ parts

$19.340

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590

$19.340

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Vyrian

USA . 3,153 parts In-Stock

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$20.358

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Flip Electronics

USA . 1,800 parts In-Stock

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1,800

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Anansix

USA . 781 parts In-Stock

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DigiKey Marketplace

USA . 300 parts In-Stock

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300

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Distributors (Availability)

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One Stop Electronics

USA . 229 parts In-Stock

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$17.300

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$17.300

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Corphita

USA . 2,107 parts In-Stock

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$18.322

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$18.322

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Component Stockers USA

USA . 909 parts In-Stock

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$20.040

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$20.040

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909

$20.040

$20.040

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Microchip USA

USA . 1,334 parts In-Stock

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$51.803

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1,334

$51.803

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A-Z Elektronik GmbH

Germany . 6,098 parts In-Stock

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6,098

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UNI Independent Distributors

Spain . 5,662 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 668 parts In-Stock

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668

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Perfect Parts

USA . 336 parts In-Stock

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336

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Technical Specifications

Microprocessors SCF5250LAG100 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

25

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

33.86 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SCF5250LAG100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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