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SCC68692E1A44,529

NXP Semiconductors

SCC68692E1A44,529 by NXP Semiconductors

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

Median Price

$5.990

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 26 parts In-Stock

1+ parts

$5.990

100+ parts

$5.870

1k+ parts

$5.750

10k+ parts

-

26

$5.990

$5.870

$5.750

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,762 parts In-Stock

1+ parts

$5.690

100+ parts

-

1k+ parts

-

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1,762

$5.690

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Vyrian

USA . 8,021 parts In-Stock

1+ parts

-

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8,021

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-

-

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Anansix

USA . 1,061 parts In-Stock

1+ parts

-

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1,061

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 26 parts In-Stock

1+ parts

$5.090

100+ parts

$4.963

1k+ parts

$4.937

10k+ parts

-

26

$5.090

$4.963

$4.937

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Corphita

USA . 1,163 parts In-Stock

1+ parts

$5.391

100+ parts

-

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1,163

$5.391

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AZTECH Wire

Italy . 1,080 parts In-Stock

1+ parts

$8.970

100+ parts

-

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1,080

$8.970

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Microchip USA

USA . 3,075 parts In-Stock

1+ parts

$16.834

100+ parts

-

1k+ parts

-

10k+ parts

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3,075

$16.834

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-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$32.763

100+ parts

$29.814

1k+ parts

$26.866

10k+ parts

-

1,000

$32.763

$29.814

$26.866

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UNI Independent Distributors

Spain . 6,787 parts In-Stock

1+ parts

-

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6,787

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Perfect Parts

USA . 29 parts In-Stock

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29

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Assy Fe

Spain . 4 parts In-Stock

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4

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Technical Specifications

Serial Communication Controllers SCC68692E1A44,529 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

4

Boundary Scan:

NO

Bus Compatibility:

S68000

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.5862 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

SCC68692E1A44,529 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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