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SC16C750BIBS,128

NXP Semiconductors

SC16C750BIBS,128 by NXP Semiconductors

SC16C750BIBS,128 by NXP Semiconductors is a Serial Communication Controller with 32 terminals and operates at 5.5V max supply voltage. It supports data transfer rates up to 0.375 MBps and has a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed asynchronous communication protocols in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,650 parts In-Stock

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6,650

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Flip Electronics

USA . 6,000 parts In-Stock

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6,000

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Anansix

USA . 1,777 parts In-Stock

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1,777

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Digiode

USA . 1,742 parts In-Stock

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1,742

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 211 parts In-Stock

1+ parts

$4.483

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211

$4.483

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One Stop Electronics

USA . 1,293 parts In-Stock

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$6.000

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1,293

$6.000

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AZTECH Wire

Italy . 826 parts In-Stock

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$15.499

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826

$15.499

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UNI Independent Distributors

Spain . 2,665 parts In-Stock

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Corphita

USA . 789 parts In-Stock

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789

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Bastille Electronics

Australia . 233 parts In-Stock

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Overview

Unlock the potential of your communication systems with the SC16C750BIBS,128 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality Serial Communication Controllers that offer unmatched reliability and performance. From industrial automation to IoT applications, this versatile chip carrier ensures seamless data transfer at a blazing speed of 0.375 MBps. With features like low power mode and wide operating temperature range, the SC16C750BIBS,128 is the perfect solution for your connectivity needs. Experience the value and benefits this cutting-edge technology brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material is cost-effective and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability ensures easy and efficient integration into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power input options, accommodating a range of systems and environments.

Address Bus Width: 3

A wider address bus width enables the controller to access and manage more memory locations, improving overall performance and data handling capabilities.

Package Shape: SQUARE

The square package shape is versatile and space-efficient, allowing for easy placement on a circuit board and optimizing layout design.

Power Supplies (V): 2.5/5

Dual power supply options of 2.5V and 5V provide compatibility with various voltage inputs, enhancing the product's versatility and usability.

No. of Terminals: 32

Having 32 terminals allows for multiple connections and interfaces, offering flexibility in connectivity and communication options for the controller.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier style, combined with heat sink/slug and very thin profile design, helps to optimize thermal management and space constraints in compact electronic devices.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures efficient power consumption and operation, contributing to energy savings and extended product longevity.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85°C allows the controller to operate reliably in a wide range of environmental conditions without risk of overheating.

Maximum Data Transfer Rate: 0.375 MBps

The high maximum data transfer rate of 0.375 MBps enables fast and efficient communication, enhancing the performance and responsiveness of the controller.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the controller can function effectively even in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity, corrosion resistance, and durability, ensuring stable and reliable connections for the controller.

Terminal Position: QUAD

The quad terminal position offers secure and stable mounting on the circuit board, enhancing the overall reliability and performance of the controller in demanding conditions.

Maximum Seated Height: 1 mm

With a maximum seated height of 1mm, the controller can be easily accommodated in slim and compact devices, optimizing space utilization and design flexibility.

Width: 5 mm

The compact width of 5mm allows for easy integration into tight spaces and small electronic devices, contributing to a streamlined and efficient product design.

External Data Bus Width: 8

The wide external data bus width of 8 enhances data transfer efficiency and capacity, enabling the controller to handle large volumes of data swiftly and accurately.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocol and bit-level data transfer facilitates flexible and efficient data exchange between the controller and external devices, enhancing compatibility and performance.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency of 48 MHz allows for fast data processing and communication, ensuring responsive performance and real-time data handling capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

The controller's ability to withstand peak reflow temperatures for up to 30 seconds ensures reliable soldering and assembly during manufacturing, contributing to product quality and longevity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C enables safe and effective soldering processes, ensuring secure connections and robust assembly in electronic devices.

Length: 5 mm

The compact length of 5mm contributes to a space-saving design for the controller, allowing for easy integration and placement within small electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation of the controller in harsh and demanding industrial environments, providing enhanced durability and performance under challenging conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The peripheral IC type of serial IO/communication controller, with serial communication capability, offers versatile connectivity and data exchange options, making it suitable for various applications.

Technology: CMOS

The CMOS technology used in the controller provides low power consumption, high-speed operation, and compatibility with a wide range of devices, ensuring efficient performance and reliability.

Terminal Form: NO LEAD

The no-lead terminal form simplifies assembly and soldering processes, improving manufacturability and reliability of the controller in electronic device production.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures stable and consistent power input for the controller, supporting reliable operation and consistent performance in various applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for dense packing and precise connections, enabling efficient integration and secure mounting of the controller on the circuit board.

Low Power Mode: YES

The low power mode feature helps to reduce energy consumption and extend battery life in portable devices or low-power applications, enhancing the efficiency and sustainability of the controller.

Technical Specifications

Serial Communication Controllers SC16C750BIBS,128 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5 V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

48 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

SC16C750BIBS,128 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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