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SAA7105HBG-T

NXP Semiconductors

SAA7105HBG-T by NXP Semiconductors

SAA7105HBG-T by NXP Semiconductors is a CMOS consumer IC designed for surface mount applications. It operates at 3.3V with a max temp of 70 °C and features a 64-terminal gull-wing package. Ideal for compact electronic devices, it ensures reliable performance in commercial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,737 parts In-Stock

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2,737

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Anansix

USA . 1,016 parts In-Stock

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1,016

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Digiode

USA . 596 parts In-Stock

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596

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,106 parts In-Stock

1+ parts

$16.800

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1,106

$16.800

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Corphita

USA . 4,394 parts In-Stock

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4,394

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UNI Independent Distributors

Spain . 883 parts In-Stock

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883

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Overview

Elevate your consumer electronics with the SAA7105HBG-T from NXP Semiconductors, a leader in innovative technology. This high-quality IC delivers reliable performance, empowering applications ranging from multimedia devices to smart home solutions. With its compact design and superior efficiency, it streamlines integration and enhances functionality. Trust in NXP's legacy of excellence to drive your projects forward, ensuring quality and durability every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the reliability and longevity of the product, making it suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for easier and more compact integration into modern electronics, facilitating efficient production and reduced board space.

Package Shape: SQUARE

The square package shape optimizes space on the PCB and allows for uniform placement, ensuring stable performance in tight configurations.

Power Supplies (V): 3.3

Operating on 3.3V makes this product compatible with a wide range of devices, ensuring energy efficiency and reducing power consumption.

No. of Terminals: 64

With 64 terminals, this IC offers extensive connectivity options for peripherals, enabling complex and versatile applications in consumer products.

Package Style (Meter): FLATPACK

The flatpack style provides a low-profile design that is ideal for compact electronic devices, maintaining an aesthetically pleasing form factor.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70 °C ensures that the product can function reliably in moderately warm environments, suitable for everyday consumer use.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows the product to function effectively in a variety of climates, making it versatile for multiple applications.

Terminal Position: QUAD

The quad terminal position enhances signal integrity and promotes efficient heat dissipation, which is crucial for maintaining performance in complex circuits.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grade signifies that this product is designed and tested for general consumer use, ensuring reliability over time.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities, making this IC efficient for modern electronic designs.

Terminal Form: GULL WING

Gull wing terminals allow for a strong mechanical connection and ease of soldering, which improves assembly processes and enhances reliability.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch is ideal for high-density applications, allowing for more terminals in a smaller space without compromising performance.

Technical Specifications

Other Function Consumer ICs SAA7105HBG-T attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

SAA7105HBG-T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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