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SAA7105H/V1

NXP Semiconductors

SAA7105H/V1 by NXP Semiconductors

SAA7105H/V1 by NXP Semiconductors is a CMOS consumer IC designed for surface mount applications. It operates at 3.3V with a max temp of 70 °C and features a 64-terminal flatpack design. Ideal for various electronic devices, it ensures reliable performance in commercial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Digiode

USA . 3,505 parts In-Stock

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Vyrian

USA . 1,436 parts In-Stock

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1,436

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Anansix

USA . 714 parts In-Stock

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714

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Chip Stock

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195

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Eagle Technology Solutions

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One Stop Electronics

USA . 1,159 parts In-Stock

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$10.800

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A-Z Elektronik GmbH

Germany . 7,148 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,259 parts In-Stock

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UNI Independent Distributors

Spain . 4,081 parts In-Stock

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Perfect Parts

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580

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S.R.D Solutions

India . 500 parts In-Stock

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Kepictronics

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Overview

Unlock endless possibilities with the SAA7105H/V1 from NXP Semiconductors, a leader in innovative technology. This premium consumer IC enhances your designs with unmatched reliability and efficiency, perfect for a range of applications including video processing, multimedia systems, and more. With its robust performance and advanced features, the SAA7105H/V1 empowers you to elevate your projects while ensuring superior quality and durability. Experience the advantage of partnering with a trusted name in semiconductor solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this IC suitable for various applications.

Surface Mount: YES

The surface mount capability allows for compact design and easier integration into modern circuit boards, enhancing reliability and performance.

Package Shape: SQUARE

The square shape promotes efficient space utilization on the PCB, allowing for high-density designs.

Power Supplies (V): 3.3

Operating at a standard 3.3V power supply improves compatibility with a wide range of devices and systems.

No. of Terminals: 64

With 64 terminals, this IC can support complex functionalities and enhanced connectivity options.

Package Style (Meter): FLATPACK

The flatpack style allows for lower profile designs, which is ideal for space-constrained applications.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70 °C ensures reliable performance in moderately hot environments.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows the IC to function in cooler conditions, expanding its application range.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for efficient connection points, facilitating easier integration into designs.

Maximum Time At Peak Reflow Temperature: 30 s

With a peak reflow time of 30 seconds, the IC can handle rapid assembly processes, making production efficient.

Peak Reflow Temperature: 245 C

The high peak reflow temperature capability ensures compatibility with modern soldering processes, contributing to robust assembly.

Temperature Grade: COMMERCIAL

Commercial grade temperature specifications make this IC suitable for a wide array of consumer applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high-speed operation, making it energy-efficient and efficient for modern tasks.

Terminal Form: GULL WING

The gull wing terminal form improves mechanical strength and provides a reliable connection, crucial for long-term operation.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm enables higher density and more compact layouts on circuit boards, ideal for today’s technology trends.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, appropriate handling and storage are necessary, ensuring the product remains in optimal condition before use.

Technical Specifications

Other Function Consumer ICs SAA7105H/V1 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SAA7105H/V1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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