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SA577N

NXP Semiconductors

SA577N by NXP Semiconductors

SA577N by NXP Semiconductors is a dual-terminal compander in a rectangular plastic/epoxy package, ideal for industrial applications. It features 14 terminals, a max height of 4.2 mm, and dimensions of 19.025 mm x 7.62 mm. This IC enhances audio signal processing efficiency.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,679 parts In-Stock

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4,679

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Digiode

USA . 3,211 parts In-Stock

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3,211

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Anansix

USA . 1,162 parts In-Stock

1+ parts

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1,162

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Pegasus Components GmbH

Germany . 26 parts In-Stock

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26

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 791 parts In-Stock

1+ parts

$0.500

100+ parts

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791

$0.500

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Corphita

USA . 4,599 parts In-Stock

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4,599

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UNI Independent Distributors

Spain . 1,599 parts In-Stock

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1,599

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Overview

Unlock unparalleled performance with the SA577N from NXP Semiconductors, a leader in innovative solutions. This analog computational marvel enhances audio processing applications, delivering superior sound quality and efficiency. Its robust design ensures reliability across various industrial environments. Experience seamless integration, reduced noise, and exceptional clarity, empowering your projects to achieve excellence while maximizing value and customer satisfaction. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for industrial applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on PCBs, allowing for efficient design and layout in various applications.

No. of Terminals: 14

Having 14 terminals enables versatile connectivity options, facilitating complex interfacing requirements in analog computations.

Package Style (Meter): IN-LINE

The in-line package style allows for easy insertion into PCBs, improving assembly efficiency and reducing overall manufacturing time.

Terminal Position: DUAL

Dual terminal positioning enhances electrical performance and allows for more flexible circuit layout options.

Maximum Seated Height: 4.2 mm

A low maximum seated height ensures compatibility with low-profile designs while maintaining robust reliability in mounting.

Width: 7.62 mm

The compact width is ideal for space-constrained applications, enabling use in smaller electronic devices without compromising functionality.

Other IC type: COMPANDER

As a compander, this IC effectively processes audio signals, enhancing dynamic range and reducing noise, which is crucial in various audio applications.

Length: 19.025 mm

The moderate length aids in board layout flexibility while still providing sufficient functional terminals for enhanced connectivity.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product is suitable for harsh environments, ensuring reliability and longevity even under extreme conditions.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability, making this product ideal for high-vibration applications commonly found in industrial settings.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm makes this device compatible with a wide variety of PCB designs and simplifies soldering processes.

Technical Specifications

Analog Computational SA577N attributes and parameters. Explore more Analog Computational devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T14

Length:

19.025 mm

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

SA577N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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