Loading...

SA572F

NXP Semiconductors

SA572F by NXP Semiconductors

SA572F by NXP Semiconductors is an industrial-grade analog compander in a 16-terminal, dual through-hole package. It features a ceramic, glass-sealed body and rectangular shape for durability. Ideal for audio processing applications, it enhances signal quality effectively.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,939 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,939

-

-

-

-

Vyrian

USA . 1,982 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,982

-

-

-

-

Anansix

USA . 323 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

323

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 974 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

-

10k+ parts

-

974

$4.500

-

-

-

UNI Independent Distributors

Spain . 7,929 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,929

-

-

-

-

Corphita

USA . 2,521 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,521

-

-

-

-

Overview

Elevate your designs with the SA572F from NXP Semiconductors, an industry leader known for precision and reliability. This analog computational gem features a robust ceramic package, ensuring durability in demanding environments. Ideal for audio processing and data communication applications, it delivers exceptional performance while simplifying your design challenges. Experience unparalleled quality and efficiency—unlock the potential of your projects today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials ensures excellent durability and resistance to environmental factors, making this product ideal for harsh industrial applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCB, facilitating easier integration into various circuit designs.

No. of Terminals: 16

With 16 terminals, this component provides ample connectivity options, allowing for complex signal processing and flexible circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style is easy to handle and mount on PCB, improving assembly speed and manufacturing efficiency.

Terminal Position: DUAL

The dual terminal position enhances layout flexibility, making circuit design easier and reducing potential interference between signals.

Other IC type: COMPANDER

As a compander, this IC effectively increases the dynamic range of audio signals, enhancing sound quality and making it suitable for audio processing applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation across a wide range of temperatures, making it suitable for demanding environments and long-term applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, enhancing the reliability of the component in physically demanding applications.

Technical Specifications

Analog Computational SA572F attributes and parameters. Explore more Analog Computational devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-GDIP-T16

No. of Terminals:

16

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

SA572F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-208-1250, 5962012081250

NIIN

012081250

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20