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S9S12DG12F1VPVER

NXP Semiconductors

S9S12DG12F1VPVER by NXP Semiconductors

MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 112; Package Code: QFP; Package Shape: SQUARE; ROM Programmability: FLASH;

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 10,000 parts In-Stock

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10,000

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Vyrian

USA . 3,617 parts In-Stock

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3,617

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Digiode

USA . 1,982 parts In-Stock

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1,982

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Anansix

USA . 745 parts In-Stock

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745

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ComSIT Distribution GmbH

Germany . 499 parts In-Stock

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499

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 118 parts In-Stock

1+ parts

$15.590

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118

$15.590

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One Stop Electronics

USA . 1,427 parts In-Stock

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$19.000

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1,427

$19.000

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Vigor

Singapore . 2,744 parts In-Stock

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$36.960

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2,744

$36.960

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Microchip USA

USA . 1,972 parts In-Stock

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$55.989

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1,972

$55.989

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UNI Independent Distributors

Spain . 5,972 parts In-Stock

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Corphita

USA . 2,856 parts In-Stock

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2,856

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Technical Specifications

Microcontrollers S9S12DG12F1VPVER attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

S9S12

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G112

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

112

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

25 rpm

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

S9S12DG12F1VPVER Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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