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S912ZVCA64F0MLFR

NXP Semiconductors

S912ZVCA64F0MLFR by NXP Semiconductors

NXP Semiconductors S912ZVCA64F0MLFR is a 16-bit microcontroller with 48 terminals, operating at up to 20 MHz. It features 1K data EEPROM, 10-Ch 12-Bit ADCs, and CAN/I2C/SCI/SPI connectivity. Ideal for automotive applications due to its low power mode, FLASH ROM programmability, and wide temperature range (-40 to 125 °C).

Median Price

$4.514

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 10,000 parts In-Stock

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Vyrian

USA . 4,343 parts In-Stock

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Digiode

USA . 524 parts In-Stock

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Anansix

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Nova Conductors

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AZTECH Wire

Italy . 1,049 parts In-Stock

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Ampacity Inc.

Singapore . 566 parts In-Stock

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One Stop Electronics

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Microchip USA

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UNI Independent Distributors

Spain . 6,899 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Vigor

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Futuretech Components

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Argo Parts USA

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Perfect Parts

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Aranea Global

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Overview

Experience superior performance and reliability with the S912ZVCA64F0MLFR microcontroller by NXP Semiconductors. Crafted with precision and cutting-edge technology, this device offers unmatched value and benefits to customers across various applications. Whether you're in automotive, industrial control, or consumer electronics, this product delivers exceptional quality and efficiency, making it the perfect choice for your next project. Trust NXP Semiconductors to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding unnecessary weight.

Maximum Supply Voltage: 40 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Bit Size: 16

A larger bit size allows for higher precision and accuracy in data processing and calculations.

No. of Terminals: 48

Having a larger number of terminals provides more connectivity options and flexibility in interfacing with other components.

Maximum Clock Frequency: 20 MHz

A high clock frequency allows for faster processing speeds and improved overall performance of the microcontroller.

Connectivity: CAN, I2C, SCI(2), SENT, SPI

The multiple connectivity options enable seamless communication with a variety of external devices and systems, increasing the versatility of the microcontroller.

Technical Specifications

Microcontrollers S912ZVCA64F0MLFR attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

S12Z

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

3.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

CAN, I2C, SCI(2), SENT, SPI

Peripherals:

COMPARATOR(2), POR, RTI, TIMER(8), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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