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PUSBM30VX4-TL,115

NXP Semiconductors

PUSBM30VX4-TL,115 by NXP Semiconductors

NXP Semiconductors' PUSBM30VX4-TL,115 is a 36V TRANS VOLTAGE SUPPRESSOR DIODE with 30V max reverse voltage. It's surface-mountable and has a peak reflow temp of 260°C for 30s. Ideal for transient suppression in various electronic applications.

Median Price

$0.315

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 117,890 parts In-Stock

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$0.330

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Rochester

USA . 116,890 parts In-Stock

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$0.315

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$0.261

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$0.233

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Verical

USA . 3,000 parts In-Stock

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$0.245

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Nova Conductors

Japan . 52 parts In-Stock

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$0.097

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Digiode

USA . 3,648 parts In-Stock

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Chip Stock

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Vyrian

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Anansix

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ACDS - Activité Composants Distribution Service

France . 39 parts In-Stock

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Corohmni

South Africa . 194 parts In-Stock

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$0.047

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Ampacity Inc.

Singapore . 97,069 parts In-Stock

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$0.092

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Netroflash

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 471 parts In-Stock

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Corphita

USA . 880 parts In-Stock

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AZTECH Wire

Italy . 2,779 parts In-Stock

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UNI Independent Distributors

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Continental Prestige Electronics

USA . 4,000 parts In-Stock

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Supply Digital

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 39 parts In-Stock

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Overview

Enhance the reliability of your electronic devices with the PUSBM30VX4-TL,115 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors ensures top-notch quality and performance in their Transient Suppression Devices. Ideal for protecting sensitive components from voltage spikes, this diode offers peace of mind and longevity to your electronics. Trust NXP Semiconductors to deliver superior protection for your valuable devices.

Feature Benefit Bullets

Surface Mount: YES

Important for easy installation on circuit boards.

Nominal Breakdown Voltage: 36 V

Provides protection against voltage spikes up to this level.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures product reliability during soldering process.

Peak Reflow Temperature °C: 260

Can withstand high temperatures common in reflow soldering.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Specifically designed for transient suppression applications.

Maximum Repetitive Peak Reverse Voltage: 30 V

Protects against reverse voltage spikes up to this level.

Polarity: UNIDIRECTIONAL

Ensures protection in one direction only, suitable for specific applications.

Technical Specifications

Transient Suppression Devices PUSBM30VX4-TL,115 attributes and parameters. Explore more Transient Suppression Devices devices from NXP Semiconductors

Specs

Nominal Breakdown Voltage:

36 V

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Repetitive Peak Reverse Voltage:

30 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PUSBM30VX4-TL,115 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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