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PUSB2X4Y

NXP Semiconductors

PUSB2X4Y by NXP Semiconductors

PUSB2X4Y by NXP Semiconductors is a single transient suppression device with a breakdown voltage range of 6-9V. It features a unidirectional diode element made of silicon and operates in temperatures from -40 to 85°C. This device, compliant with IEC standards, is commonly used for surge protection in electronic circuits.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Chip Stock

USA . 11,500 parts In-Stock

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Vyrian

USA . 3,953 parts In-Stock

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Bristol Electronics

USA . 2,310 parts In-Stock

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Anansix

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Digiode

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Nova Conductors

Japan . 79 parts In-Stock

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One Stop Electronics

USA . 302 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,174 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Ampacity Inc.

Singapore . 666 parts In-Stock

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AZTECH Wire

Italy . 11,922 parts In-Stock

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RC Electronics

USA . 101,590 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

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UNI Independent Distributors

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Continental Prestige Electronics

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Lixinc

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Supply Digital

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Argo Parts USA

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Bastille Electronics

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Overview

Enhance the reliability of your electronic devices with the PUSB2X4Y by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-notch Transient Suppression Devices that cater to a wide range of applications. This product offers unparalleled quality and performance, ensuring protection against voltage spikes and surges. With its advanced technology and durable construction, the PUSB2X4Y provides peace of mind for both manufacturers and end-users. Upgrade your devices today with this exceptional component and experience the difference in quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components of the device, ensuring reliability in various operating conditions.

Config: SINGLE

The single configuration simplifies the installation and use of the transient suppression device, making it easier for users to integrate into their systems.

Surface Mount: YES

Being surface mountable allows for easy and convenient PCB assembly, saving space and reducing overall system footprint.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this transient suppression device can withstand heat and operate effectively in harsh environments.

Minimum Breakdown Voltage: 6 V

The minimum breakdown voltage of 6 V ensures reliable protection against transient voltage spikes, safeguarding connected components from damage.

Reference Standard: IEC-60134; IEC-61000-4-2, 4-5

Compliance with international standards such as IEC-60134 and IEC-61000-4-2, 4-5 ensures the reliability and performance of the transient suppression device.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The use of trans voltage suppressor diode ensures efficient transient voltage suppression, providing reliable protection for sensitive electronic equipment.

Technical Specifications

Transient Suppression Devices PUSB2X4Y attributes and parameters. Explore more Transient Suppression Devices devices from NXP Semiconductors

Specs

Additional Features:

ULTRA LOW CAPACITANCE

Maximum Breakdown Voltage:

9 V

Minimum Breakdown Voltage:

6 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Polarity:

UNIDIRECTIONAL

Reference Standard:

IEC-60134; IEC-61000-4-2, 4-5

Maximum Repetitive Peak Reverse Voltage:

5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Trade Compliance

PUSB2X4Y Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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