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PSMN1R7-25YLC,115

NXP Semiconductors

PSMN1R7-25YLC,115 by NXP Semiconductors

PSMN1R7-25YLC,115 from NXP Semiconductors is an N-channel MOSFET designed for high-efficiency power applications. It supports a max drain current of 100 A and power dissipation of 164 W, operating up to 175 °C. Ideal for surface mount designs in automotive and industrial sectors.

Median Price

$0.953

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 133 parts In-Stock

1+ parts

-

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$0.953

1k+ parts

$0.791

10k+ parts

$0.705

133

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$0.791

$0.705

Avnet

USA . 133 parts In-Stock

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133

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Digiode

USA . 1,428 parts In-Stock

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$0.381

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$0.381

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Vyrian

USA . 4,607 parts In-Stock

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Anansix

USA . 298 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,933 parts In-Stock

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$0.361

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$0.361

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Component Stockers USA

USA . 125 parts In-Stock

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$0.410

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$0.380

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AZTECH Wire

Italy . 1,096 parts In-Stock

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$13.730

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$13.730

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QUARKTWIN TECHNOLOGY LTD

USA . 6,145 parts In-Stock

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UNI Independent Distributors

Spain . 1,435 parts In-Stock

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Microchip USA

USA . 300 parts In-Stock

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Overview

Unlock superior performance with the PSMN1R7-25YLC,115 from NXP Semiconductors. Renowned for their commitment to excellence, NXP delivers this cutting-edge power FET that ensures reliability and efficiency in diverse applications, from automotive to industrial systems. With its robust design and exceptional thermal management, this transistor empowers your projects while minimizing downtime. Elevate your innovations and experience unmatched quality with NXP!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

The N-Channel configuration allows for higher electron mobility, providing efficient switching and better performance in high-speed applications.

Configuration: SINGLE

A single configuration simplifies integration into circuits, making it easier for designers to use in various applications.

Surface Mount: YES

Surface mount technology ensures a smaller footprint on the PCB, facilitating compact design and efficient use of space.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are ideal for many applications due to their ability to be turned off completely, which reduces power consumption when not in use.

Maximum Drain Current (Abs) (ID): 100 A

A high maximum drain current makes this FET suitable for high-power applications, ensuring reliable performance under demanding conditions.

Maximum Power Dissipation (Abs): 164 W

With a maximum power dissipation of 164 W, this product can handle significant power loads, reducing the risk of overheating and failure.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and fast switching speeds, making this FET an excellent choice for digital and analog applications.

Maximum Operating Temperature: 175 °C

A high operating temperature rating indicates reliability in extreme conditions, making it suitable for harsh environments.

Terminal Finish: TIN

TIN terminal finish ensures good solderability and reduces the risk of oxidation, which improves the longevity of the device.

Maximum Time At Peak Reflow Temperature (s): 30

The 30 seconds maximum time at peak reflow temperature is advantageous for consistency during manufacturing processes, ensuring device integrity.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows compatibility with lead-free soldering processes, aligning with modern environmental standards.

Technical Specifications

Power Field Effect Transistors (FET) PSMN1R7-25YLC,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

100 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PSMN1R7-25YLC,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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