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PSMN027-100XS,127

NXP Semiconductors

PSMN027-100XS,127 by NXP Semiconductors

PSMN027-100XS,127 by NXP Semiconductors is an N-channel enhancement mode FET ideal for power management applications. It supports a max drain current of 23.4 A and power dissipation of 41.1 W, operating up to 175 °C. This MOSFET excels in efficient energy conversion and control.

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4

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1k+

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Chip Stock

USA . 53,000 parts In-Stock

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Vyrian

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Anansix

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Digiode

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AZTECH Wire

Italy . 330 parts In-Stock

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One Stop Electronics

USA . 1,028 parts In-Stock

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$40.050

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QUARKTWIN TECHNOLOGY LTD

USA . 14,543 parts In-Stock

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Microchip USA

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Corphita

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UNI Independent Distributors

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Perfect Parts

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Overview

Unlock unparalleled performance and reliability with the PSMN027-100XS,127 from NXP Semiconductors. Renowned for their high-quality manufacturing, NXP delivers a powerful N-channel FET that excels in demanding applications, from industrial automation to renewable energy systems. Experience exceptional efficiency, impressive thermal management, and robust reliability, all designed to elevate your projects while reducing downtime and maintenance costs. Choose NXP for innovative solutions that empower your success!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher electron mobility, making them more efficient for high-speed applications.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it ideal for a variety of applications where space is at a premium.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better control over the conductive state, allowing for more precise switching and lower power consumption in digital circuits.

Maximum Drain Current (Abs) (ID): 23.4 A

With a maximum drain current of 23.4 A, this FET can handle significant loads, making it suitable for power-intensive applications.

Maximum Power Dissipation (Abs): 41.1 W

A power dissipation rating of 41.1 W ensures that the FET can operate efficiently without overheating, enhancing reliability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low-excitation power, making this FET ideal for battery-powered and low-power applications.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature of 175 °C allows this FET to function in demanding environments, ensuring durability and versatility.

Maximum Drain Current (ID): 23.4 A

Reiterated maximum drain current underscores its capacity for robust applications, enabling high-performance use cases without risk of failure.

Technical Specifications

Power Field Effect Transistors (FET) PSMN027-100XS,127 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

23.4 A

Maximum Drain Current (ID):

23.4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Trade Compliance

PSMN027-100XS,127 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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