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PR5331C3HN/C370E

NXP Semiconductors

PR5331C3HN/C370E by NXP Semiconductors

PR5331C3HN/C370E by NXP Semiconductors is a 40-terminal interface IC with a supply voltage range of 2.5V to 3.6V, operating b/w -30°C to 85°C. It features a square chip carrier package suitable for surface mount applications, with terminal finish in nickel palladium gold. Ideal for various other function interface applications requiring a compact and reliable solution.

Median Price

$11.104

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,453 parts In-Stock

1+ parts

$15.900

100+ parts

$10.220

1k+ parts

$9.520

10k+ parts

-

1,453

$15.900

$10.220

$9.520

-

Rochester

USA . 490 parts In-Stock

1+ parts

-

100+ parts

$7.750

1k+ parts

$6.940

10k+ parts

$6.530

490

-

$7.750

$6.940

$6.530

Verical

USA . 490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$11.104

10k+ parts

$10.425

490

-

-

$11.104

$10.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,008 parts In-Stock

1+ parts

$8.180

100+ parts

-

1k+ parts

-

10k+ parts

-

2,008

$8.180

-

-

-

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$8.674

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$8.674

-

-

-

Anansix

USA . 1,555 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,555

-

-

-

-

Vyrian

USA . 1,081 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,081

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,010 parts In-Stock

1+ parts

$7.320

100+ parts

-

1k+ parts

-

10k+ parts

-

1,010

$7.320

-

-

-

Corphita

USA . 3,733 parts In-Stock

1+ parts

$7.749

100+ parts

-

1k+ parts

-

10k+ parts

-

3,733

$7.749

-

-

-

Continental Prestige Electronics

USA . 480 parts In-Stock

1+ parts

$8.674

100+ parts

-

1k+ parts

-

10k+ parts

$8.500

480

$8.674

-

-

$8.500

Argo Parts USA

USA . 3,803 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,803

-

-

-

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Lixinc

USA . 3,238 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,238

-

-

-

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UNI Independent Distributors

Spain . 335 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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335

-

-

-

-

Overview

Experience seamless connectivity and reliable performance with the PR5331C3HN/C370E by NXP Semiconductors. Known for their superior quality and cutting-edge technology, NXP Semiconductors delivers top-notch products that exceed expectations. This interface IC offers a wide range of applications, making it versatile and practical for various industries. Customers can expect enhanced efficiency, increased productivity, and cost savings with this innovative solution. Trust NXP Semiconductors to provide you with outstanding products that elevate your business to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product is suitable for applications requiring higher voltage levels.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, making it a compact choice for designs with limited space.

No. of Terminals: 40

With a high number of terminals, this product offers versatile connectivity options, making it suitable for complex circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offer thermal management capabilities and space-saving design options for efficient performance.

Minimum Supply Voltage: 2.5 V

The low minimum supply voltage allows for flexibility in power requirements, enabling compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows for reliable performance in cold environments, expanding the range of applications where this product can be utilized.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures reliable and corrosion-resistant connections, promoting long-term performance and durability.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections, reducing the risk of signal interference or loss, enhancing overall performance.

Maximum Seated Height: 1 mm

With a low maximum seated height, this product offers a compact profile, making it suitable for designs where space constraints are critical.

Width: 6 mm

The 6mm width provides a balance between compact size and sufficient surface area for terminal connections, offering versatility in board layout.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for up to 30 seconds ensures reliable soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can undergo robust soldering processes, resulting in strong and durable connections.

Length: 6 mm

The 6mm length offers a balanced size for the overall package, contributing to a compact and efficient design.

Terminal Form: NO LEAD

The no-lead terminal form promotes environmental sustainability and complies with regulations, making it an eco-friendly choice for electronic designs.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources, simplifying integration into existing systems.

Terminal Pitch: 0.5 mm

With a fine terminal pitch of 0.5mm, this product allows for high-density mounting and precise connections, suitable for compact designs with limited space.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 indicates that this product has a moderate sensitivity to moisture during storage or assembly processes, requiring standard handling precautions.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication and data exchange between various components, making it essential for interfacing different systems or devices.

Technical Specifications

Other Function Interface ICs PR5331C3HN/C370E attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

PR5331C3HN/C370E Interface ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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