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PMV170UN,215

NXP Semiconductors

PMV170UN,215 by NXP Semiconductors

PMV170UN,215 by NXP Semiconductors is a single N-channel Power FET with 1A max drain current and 1.14W max power dissipation. Ideal for applications requiring enhancement mode operation, such as power management systems in electronics.

Median Price

$0.287

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

$0.298

1k+ parts

$0.247

10k+ parts

$0.220

33,000

-

$0.298

$0.247

$0.220

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.276

15,000

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-

-

$0.276

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,556 parts In-Stock

1+ parts

$0.124

100+ parts

-

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3,556

$0.124

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Vyrian

USA . 6,665 parts In-Stock

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6,665

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Anansix

USA . 1,342 parts In-Stock

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1,342

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Distributors (Availability)

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Corphita

USA . 4,018 parts In-Stock

1+ parts

$0.117

100+ parts

-

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4,018

$0.117

-

-

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AZTECH Wire

Italy . 13,257 parts In-Stock

1+ parts

$17.690

100+ parts

-

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13,257

$17.690

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Continental Prestige Electronics

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.156

10k+ parts

-

33,000

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$0.156

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QUARKTWIN TECHNOLOGY LTD

USA . 16,354 parts In-Stock

1+ parts

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16,354

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Kepictronics

USA . 11,560 parts In-Stock

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11,560

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A-Z Elektronik GmbH

Germany . 7,784 parts In-Stock

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7,784

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UNI Independent Distributors

Spain . 4,534 parts In-Stock

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4,534

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Supply Digital

USA . 2,012 parts In-Stock

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2,012

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Microchip USA

USA . 471 parts In-Stock

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471

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Overview

Discover the power of NXP Semiconductors with the PMV170UN,215 Power Field Effect Transistor. This N-CHANNEL device offers reliable performance and efficiency in a single configuration, perfect for a variety of applications. With its enhancement mode operation and high maximum drain current, this transistor is designed to meet your power needs while maintaining a low power dissipation. Trust in NXP Semiconductors to deliver quality components that provide value and benefits to your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and fast switching speeds, making this product suitable for applications requiring quick response times.

Configuration: SINGLE

A single configuration simplifies the design and implementation of circuits, making it easier to integrate this FET into various electronic systems.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, making this FET ideal for applications where space is limited.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and low on-state resistance, leading to improved efficiency and performance in electronic circuits.

Maximum Drain Current (Abs) (ID): 1 A

With a maximum drain current of 1A, this FET can handle moderate power requirements, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 1.14 W

The high maximum power dissipation rating allows this FET to handle heat dissipation effectively, ensuring reliability and longevity in operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good thermal stability and high input impedance, making this FET well-suited for various voltage-controlled applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can operate reliably under challenging environmental conditions without compromising performance.

Terminal Finish: TIN

Tin terminal finish provides good solderability and conductivity, ensuring secure connections and reliable performance in electronic circuits.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds allows for efficient soldering processes, reducing the risk of thermal damage to the FET.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260°C ensures proper soldering and reflow processes, leading to reliable connections and long-term performance of the FET.

Technical Specifications

Power Field Effect Transistors (FET) PMV170UN,215 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

1 A

Maximum Drain Current (ID):

1 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PMV170UN,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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