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PMDPB70XPE,115

NXP Semiconductors

PMDPB70XPE,115 by NXP Semiconductors

PMDPB70XPE,115 by NXP Semiconductors is a P-CHANNEL FET with 3A max drain current and 8.33W power dissipation. It operates in enhancement mode, suitable for applications requiring high temperature tolerance up to 150°C. Ideal for surface mount designs needing reliable performance in various electronic devices.

Median Price

$0.112

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 9,000 parts In-Stock

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$0.112

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$0.112

Verical

USA . 9,000 parts In-Stock

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$0.112

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$0.112

Chip1Stop

Japan . 9,000 parts In-Stock

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$0.124

9,000

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$0.124

Distributors (In-Stock)

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Digiode

USA . 4,624 parts In-Stock

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$0.484

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$0.484

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Chip Stock

USA . 98,000 parts In-Stock

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Vyrian

USA . 7,714 parts In-Stock

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NAC Semi

USA . 6,000 parts In-Stock

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$0.168

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$0.168

IBS Electronics

USA . 6,000 parts In-Stock

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$0.139

6,000

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$0.139

Anansix

USA . 2,887 parts In-Stock

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Nova Conductors

Japan . 44 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 10,234 parts In-Stock

1+ parts

$0.097

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$0.097

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AZTECH Wire

Italy . 8,466 parts In-Stock

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$0.120

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Corphita

USA . 1,184 parts In-Stock

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$0.459

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$0.459

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Component Stockers USA

USA . 32,195 parts In-Stock

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$0.510

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$0.220

1k+ parts

$0.150

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$0.110

32,195

$0.510

$0.220

$0.150

$0.110

Corohmni

South Africa . 114 parts In-Stock

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$0.773

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114

$0.773

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$2.013

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$1.832

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$1.651

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200

$2.013

$1.832

$1.651

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Perfect Parts

USA . 10,080 parts In-Stock

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UNI Independent Distributors

Spain . 8,029 parts In-Stock

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Futuretech Components

Singapore . 6,000 parts In-Stock

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Glotronic Ltd.

UK . 4,800 parts In-Stock

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4,800

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Continental Prestige Electronics

USA . 2,030 parts In-Stock

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Supply Digital

USA . 2,026 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 747 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the NXP Semiconductors PMDPB70XPE,115 P-CHANNEL transistor. Designed for enhanced performance and reliability, this surface-mount transistor offers a maximum drain current of 3A and a maximum power dissipation of 8.33W. Perfect for a wide range of applications, from consumer electronics to industrial equipment, this transistor delivers exceptional value and efficiency. Trust NXP Semiconductors for top-quality components that elevate your projects to new heights.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL transistors are suitable for applications requiring high voltage handling capabilities and low ON-state resistance, making this product a good choice for power management circuits.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs, making this product suitable for compact electronic devices.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are easier to integrate into digital and analog circuits, offering versatility and flexibility in circuit design, making this product a good choice for a wide range of applications.

Maximum Drain Current (Abs) (ID): 3 A

High maximum drain current rating ensures the device can handle a substantial amount of current, making it suitable for applications where high power handling is required.

Maximum Power Dissipation (Abs): 8.33 W

High power dissipation capacity allows the transistor to operate reliably even under high load conditions, making it suitable for power electronics applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and efficiency, making this product ideal for applications requiring fast switching speeds and low power consumption.

Maximum Operating Temperature: 150 °C

High maximum operating temperature rating ensures the device can withstand elevated temperatures, making it suitable for harsh environmental conditions.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections, making this product suitable for long-term use.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature enables efficient and reliable soldering during manufacturing processes, ensuring consistent quality in final products.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for lead-free soldering processes and reliable solder joints, ensuring compliance with modern manufacturing standards.

Technical Specifications

Other Function Transistors PMDPB70XPE,115 attributes and parameters. Explore more Other Function Transistors devices from NXP Semiconductors

Specs

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PMDPB70XPE,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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