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PMDPB30XN,115

NXP Semiconductors

PMDPB30XN,115 by NXP Semiconductors

PMDPB30XN,115 by NXP Semiconductors is an N-CHANNEL Power FET with 4A max drain current and 8.33W max power dissipation. Ideal for applications requiring high efficiency in a surface mount package, such as power management systems or motor control circuits operating up to 150°C.

Median Price

$0.123

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Chip1Stop

Japan . 6,000 parts In-Stock

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$0.123

Arrow

USA . 3,000 parts In-Stock

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$0.117

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Verical

USA . 3,000 parts In-Stock

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$0.109

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$0.109

Farnell

UK . 265 parts In-Stock

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$0.230

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$0.134

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$0.130

265

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$0.230

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$0.130

Element14

Singapore . 265 parts In-Stock

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$0.236

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$0.137

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$0.130

265

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$0.236

$0.137

$0.130

Distributors (In-Stock)

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Nova Conductors

Japan . 89 parts In-Stock

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$0.169

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Digiode

USA . 1,618 parts In-Stock

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$0.514

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Chip Stock

USA . 85,000 parts In-Stock

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Vyrian

USA . 6,106 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 4,546 parts In-Stock

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Conversion2

USA . 3,000 parts In-Stock

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IBS Electronics

USA . 2,730 parts In-Stock

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$0.240

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Anansix

USA . 668 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,373 parts In-Stock

1+ parts

$0.093

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$0.093

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Component Stockers USA

USA . 22,616 parts In-Stock

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$0.210

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$0.170

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$0.150

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$0.110

22,616

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$0.170

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$0.110

AZTECH Wire

Italy . 14,106 parts In-Stock

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$0.230

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Corphita

USA . 3,141 parts In-Stock

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$0.487

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$0.487

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Continental Prestige Electronics

USA . 2,165 parts In-Stock

1+ parts

$0.538

100+ parts

$0.260

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$0.147

10k+ parts

$0.111

2,165

$0.538

$0.260

$0.147

$0.111

Corohmni

South Africa . 22 parts In-Stock

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$1.444

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22

$1.444

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Aztec Data Supply Inc.

USA . 2,968 parts In-Stock

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$1.691

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Futuretech Components

Singapore . 11,980 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,801 parts In-Stock

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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Argo Parts USA

USA . 2,711 parts In-Stock

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UNI Independent Distributors

Spain . 1,422 parts In-Stock

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Supply Digital

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Kepictronics

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Netroflash

USA . 50 parts In-Stock

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$0.157

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Overview

Unleash the power of innovation with the PMDPB30XN,115 by NXP Semiconductors. This top-of-the-line N-CHANNEL Power FET offers unparalleled reliability and performance for a wide range of applications. With a maximum drain current of 4A and a peak power dissipation of 8.33W, this transistor is designed to exceed your expectations. Whether you're working on automotive electronics or industrial control systems, this enhancement mode FET delivers the efficiency and precision you need. Trust NXP Semiconductors to provide cutting-edge technology that empowers your projects to reach new heights.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and fast switching capabilities, making them ideal for use in power electronics applications.

Surface Mount: YES

Surface mount FETs are more compact and lighter compared to through-hole components, saving space and reducing weight in electronic designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have a high input impedance and can be easily controlled by applying a voltage, allowing for precise and efficient power control.

Maximum Drain Current (ID): 4 A

With a high maximum drain current, this FET can handle heavy loads and provide reliable performance in demanding applications.

Maximum Power Dissipation: 8.33 W

The high maximum power dissipation rating ensures that the FET can operate at high power levels without overheating, increasing its reliability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer low gate capacitance and high input impedance, resulting in improved switching speed and reduced power losses.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the FET to withstand elevated temperatures in industrial and automotive environments, ensuring stable performance under harsh conditions.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections and long-term durability.

Maximum Time At Peak Reflow Temperature (s): 30

With a short maximum time at peak reflow temperature, this FET can be easily and safely soldered onto printed circuit boards, streamlining the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance enables the FET to withstand the soldering process without damage, ensuring proper solder joints and reliable connections.

Technical Specifications

Power Field Effect Transistors (FET) PMDPB30XN,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PMDPB30XN,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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