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PHP165NQ08T,127

NXP Semiconductors

PHP165NQ08T,127 by NXP Semiconductors

PHP165NQ08T,127 from NXP Semiconductors is a single N-channel enhancement mode FET ideal for high-power applications. It supports a max drain current of 75 A and power dissipation of 250 W, operating up to 150 °C. This transistor is perfect for efficient power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 3,417 parts In-Stock

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3,417

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Anansix

USA . 2,150 parts In-Stock

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2,150

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Vyrian

USA . 2,063 parts In-Stock

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2,063

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 95 parts In-Stock

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$19.880

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95

$19.880

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One Stop Electronics

USA . 940 parts In-Stock

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$58.050

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940

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UNI Independent Distributors

Spain . 4,600 parts In-Stock

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Corphita

USA . 789 parts In-Stock

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789

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Microchip USA

USA . 174 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 10 parts In-Stock

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Overview

Unlock unparalleled performance with the PHP165NQ08T,127 from NXP Semiconductors—a leader in high-quality power solutions. This N-channel power FET is designed for efficiency and reliability, making it perfect for demanding applications like automotive systems and industrial automation. Experience enhanced energy management and robust thermal capabilities, ensuring your projects stay on track while maximizing performance and longevity. Elevate your designs with NXP's trusted innovation!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

The N-channel type allows for higher electron mobility, leading to better performance in switching applications.

Configuration: SINGLE

A single configuration simplifies circuit design and integration into various electronic applications.

Operating Mode: ENHANCEMENT MODE

The enhancement mode allows for improved efficiency in applications by requiring a positive gate-source voltage to conduct.

Maximum Drain Current (Abs) (ID): 75 A

With a maximum drain current of 75 A, this FET can handle high load requirements, making it suitable for power-intensive applications.

Maximum Power Dissipation (Abs): 250 W

A maximum power dissipation of 250 W ensures reliable operation under significant thermal conditions, reducing the risk of overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to faster switching speeds and lower power consumption, enhancing overall efficiency.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can operate in demanding environments, ensuring reliability and longevity.

Maximum Drain Current (ID): 75 A

Reiterating the capacity to handle up to 75 A makes it an excellent choice for applications requiring robust current handling.

Technical Specifications

Power Field Effect Transistors (FET) PHP165NQ08T,127 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Trade Compliance

PHP165NQ08T,127 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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