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P89V51RD2FBC,557

NXP Semiconductors

P89V51RD2FBC,557 by NXP Semiconductors

NXP Semiconductors P89V51RD2FBC,557 is an 8051 microcontroller with 8-bit architecture, 16-bit address bus, and 40 MHz clock frequency. Ideal for industrial applications due to its flash ROM programmability, 1024 bytes of RAM, and 32 I/O lines for versatile connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,200 parts In-Stock

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Digiode

USA . 3,989 parts In-Stock

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Anansix

USA . 1,561 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 255 parts In-Stock

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$5.199

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Ampacity Inc.

Singapore . 1,450 parts In-Stock

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$16.000

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One Stop Electronics

USA . 1,174 parts In-Stock

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$34.000

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Microchip USA

USA . 5,039 parts In-Stock

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Corphita

USA . 4,785 parts In-Stock

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UNI Independent Distributors

Spain . 4,336 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Overview

Unleash the power of innovation with the P89V51RD2FBC,557 microcontroller from NXP Semiconductors. Designed for versatility and reliability, this cutting-edge device offers a seamless integration into a wide range of applications. With a focus on quality and precision, NXP Semiconductors leads the industry in manufacturing excellence. Experience the value of enhanced performance, efficiency, and functionality that this microcontroller provides, making it the ideal choice for your next project. Elevate your designs to new heights with the P89V51RD2FBC,557 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power input, making it compatible with a wide range of systems.

CPU Family: 8051

The 8051 CPU family is well-known for its reliability and versatility, making this microcontroller a trusted choice for many projects.

Maximum Clock Frequency: 40 MHz

With a high maximum clock frequency, this microcontroller can handle tasks quickly and efficiently, suitable for demanding applications.

RAM Bytes: 1024

With a decent amount of RAM, this microcontroller can handle data processing effectively, making it suitable for complex tasks.

Technical Specifications

Microcontrollers P89V51RD2FBC,557 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

P89V51RD2FBC,557 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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