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P89LPC935FDH,518

NXP Semiconductors

P89LPC935FDH,518 by NXP Semiconductors

NXP Semiconductors P89LPC935FDH,518 is an 8-bit microcontroller with 2.5/3.3V power supplies and 768 bytes of RAM. Ideal for industrial applications, it features a flash ROM programmability, operates b/w -40 to 85°C, and has a peak reflow temperature of 260°C.

Median Price

$1.658

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$1.658

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500

$1.658

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Vyrian

USA . 6,067 parts In-Stock

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6,067

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Digiode

USA . 2,915 parts In-Stock

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Anansix

USA . 1,673 parts In-Stock

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1,673

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Distributors (Availability)

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Microchip USA

USA . 463 parts In-Stock

1+ parts

$3.057

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463

$3.057

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AZTECH Wire

Italy . 741 parts In-Stock

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$8.286

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741

$8.286

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One Stop Electronics

USA . 517 parts In-Stock

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$22.000

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517

$22.000

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Ampacity Inc.

Singapore . 970 parts In-Stock

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$24.000

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970

$24.000

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UNI Independent Distributors

Spain . 4,752 parts In-Stock

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Corphita

USA . 4,335 parts In-Stock

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4,335

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$1.625

1k+ parts

$1.575

10k+ parts

$1.542

500

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$1.625

$1.575

$1.542

Overview

Unlock the power of innovation with the NXP Semiconductors P89LPC935FDH,518 microcontroller. Designed with precision and reliability, this product offers unmatched performance in a compact package. Ideal for a wide range of applications, from consumer electronics to industrial automation, this microcontroller delivers superior efficiency and flexibility. Experience seamless integration and cutting-edge technology with NXP Semiconductors, setting new standards for quality and excellence in the industry. Elevate your projects with the P89LPC935FDH,518 and discover a world of possibilities at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving space and making manufacturing more streamlined.

Bit Size: 8

An 8-bit microcontroller offers sufficient processing power for a wide range of applications while keeping costs relatively low.

Power Supplies (V): 2.5/3.3

Supports multiple power supply options, providing flexibility in system design and compatibility with various power sources.

No. of Terminals: 28

With 28 terminals, this microcontroller can accommodate a variety of inputs and outputs, enabling versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the PCB and allows for compact designs in space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions without sacrificing performance.

CPU Family: 8051

Belonging to the 8051 CPU family, this microcontroller benefits from a well-established architecture with a wide range of development tools and resources available.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold environments, making it suitable for a broad range of industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable connections over long-term use.

ROM Words: 8192

With 8192 ROM words, this microcontroller can store a significant amount of program code, allowing for complex functionality and applications.

Maximum Time At Peak Reflow Temperature (s): 30

This microcontroller can withstand peak reflow temperatures for up to 30 seconds, facilitating efficient manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this microcontroller can be reliably soldered onto PCBs using standard reflow soldering processes.

Technology: CMOS

Utilizing CMOS technology, this microcontroller offers low power consumption and high noise immunity, making it suitable for battery-powered and noise-sensitive applications.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this microcontroller is moderately sensitive to moisture, requiring standard precautions during storage and handling.

Speed: 12 rpm

Operating at a speed of 12 rpm, this microcontroller provides a balance between performance and power efficiency, suitable for a wide range of applications.

Technical Specifications

Microcontrollers P89LPC935FDH,518 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

Bit Size:

8

CPU Family:

8051

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

768

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

P89LPC935FDH,518 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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