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P89LPC922FN,112

NXP Semiconductors

P89LPC922FN,112 by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$1.210

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 94 parts In-Stock

1+ parts

$1.210

100+ parts

$1.190

1k+ parts

$1.160

10k+ parts

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94

$1.210

$1.190

$1.160

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 6 parts In-Stock

1+ parts

$2.310

100+ parts

$1.730

1k+ parts

$1.500

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6

$2.310

$1.730

$1.500

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Digiode

USA . 2,745 parts In-Stock

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2,745

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Anansix

USA . 2,061 parts In-Stock

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2,061

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Vyrian

USA . 2,000 parts In-Stock

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2,000

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Distributors (Availability)

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AZTECH Wire

Italy . 210 parts In-Stock

1+ parts

$17.850

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-

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210

$17.850

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One Stop Electronics

USA . 139 parts In-Stock

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$18.000

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139

$18.000

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Component Stockers USA

USA . 267 parts In-Stock

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$99.990

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267

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 16,513 parts In-Stock

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16,513

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Microchip USA

USA . 3,839 parts In-Stock

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3,839

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Corphita

USA . 1,962 parts In-Stock

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1,962

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Vigor

Singapore . 750 parts In-Stock

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750

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UNI Independent Distributors

Spain . 342 parts In-Stock

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342

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Technical Specifications

Microcontrollers P89LPC922FN,112 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

OPERATES AT 2.4V MINIMUM SUPPLY @ 12 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

18 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

26.73 mm

No. of I/O Lines:

18

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

4.2 mm

Speed:

18 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

P89LPC922FN,112 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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