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P89LPC913FDH,129

NXP Semiconductors

P89LPC913FDH,129 by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$4.710

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 834 parts In-Stock

1+ parts

-

100+ parts

$4.710

1k+ parts

$4.220

10k+ parts

$3.970

834

-

$4.710

$4.220

$3.970

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,608 parts In-Stock

1+ parts

$4.988

100+ parts

-

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3,608

$4.988

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Vyrian

USA . 7,034 parts In-Stock

1+ parts

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7,034

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Anansix

USA . 967 parts In-Stock

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967

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,646 parts In-Stock

1+ parts

$4.725

100+ parts

-

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1,646

$4.725

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Vigor

Singapore . 834 parts In-Stock

1+ parts

$5.040

100+ parts

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834

$5.040

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Component Stockers USA

USA . 1,036 parts In-Stock

1+ parts

$5.460

100+ parts

$5.130

1k+ parts

-

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1,036

$5.460

$5.130

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Microchip USA

USA . 247 parts In-Stock

1+ parts

$6.763

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247

$6.763

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AZTECH Wire

Italy . 1,043 parts In-Stock

1+ parts

$17.980

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1,043

$17.980

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QUARKTWIN TECHNOLOGY LTD

USA . 14,809 parts In-Stock

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14,809

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UNI Independent Distributors

Spain . 2,557 parts In-Stock

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2,557

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Continental Prestige Electronics

USA . 834 parts In-Stock

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834

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Technical Specifications

Microcontrollers P89LPC913FDH,129 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

OPERATES AT 2.4V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

18 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

12

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

18 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

P89LPC913FDH,129 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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