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P87C554SFAA,512

NXP Semiconductors

P87C554SFAA,512 by NXP Semiconductors

NXP Semiconductors P87C554SFAA,512 is an 8051 microcontroller with 8-bit CPU, 16 MHz clock frequency, and 512 bytes of RAM. It features OTPROM ROM programmability and ADC channels for industrial applications requiring a max supply voltage of 5.5 V.

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5

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1k+

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Vyrian

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Digiode

USA . 1,785 parts In-Stock

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Bristol Electronics

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Nova Conductors

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One Stop Electronics

USA . 537 parts In-Stock

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AZTECH Wire

Italy . 860 parts In-Stock

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Microchip USA

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Modulus Dynamics

Lithuania . 1,877 parts In-Stock

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Corohmni

South Africa . 438 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Unlock endless possibilities with the NXP Semiconductors P87C554SFAA,512 microcontroller. Crafted with precision and expertise, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller is designed to streamline processes and enhance efficiency. With advanced features and top-notch quality, the P87C554SFAA,512 delivers exceptional value and benefits to customers seeking cutting-edge technology. Experience innovation like never before with this powerful microcontroller from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for a wide range of applications.

Surface Mount: YES

Easy to integrate onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options.

Address Bus Width: 16

Supports larger memory addressing capabilities for complex applications.

Package Shape: SQUARE

Compact shape that helps optimize board space and layout.

Bit Size: 8

Suitable for handling a wide range of data processing tasks efficiently.

Power Supplies (V): 3/5

Compatible with different power sources for versatile use.

No. of Terminals: 68

Plenty of connection points for various input/output requirements.

Minimum Supply Voltage: 2.7 V

Allows for operation in lower power scenarios for energy efficiency.

CPU Family: 8051

Well-established and widely supported microcontroller family for reliability.

Maximum Operating Temperature: 85 °C

Ensures stable performance in high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in cold environments with reliable operation.

Terminal Finish: Tin (Sn)

Provides a good soldering surface for secure connections.

ADC Channels: YES

Allows for analog-to-digital conversion capabilities for sensor interfacing.

Terminal Position: QUAD

Convenient terminal layout for easy board design and assembly.

ROM Words: 16384

Sufficient memory capacity for storing program instructions and data.

Width: 24.23 mm

Compact width for easy integration into tight spaces.

External Data Bus Width: 8

Efficient data transfer capability for handling information exchange.

Maximum Clock Frequency: 16 MHz

High clock speed for rapid data processing and responsiveness.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for handling various control and processing tasks.

RAM Bytes: 512

Adequate random access memory for storing temporary data during operation.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Maximum Supply Current: 16 mA

Low current draw for energy-efficient performance.

Nominal Supply Voltage: 5 V

Standard voltage level for compatibility with most power sources.

Moisture Sensitivity Level (MSL): 3

Ensures safe handling and storage in moderate humidity environments.

No. of I/O Lines: 48

Plenty of input/output options for connecting to external devices and sensors.

Technical Specifications

Microcontrollers P87C554SFAA,512 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e3

Length:

24.23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

16 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Peripheral IC Type:

Trade Compliance

P87C554SFAA,512 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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