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P87C52SFAA

NXP Semiconductors

P87C52SFAA by NXP Semiconductors

The NXP Semiconductors P87C52SFAA is an 8051 microcontroller with 8-bit CPU, 16 MHz clock frequency, and 256 bytes of RAM. It operates b/w -40 to 85°C and has a max supply voltage of 5.5V. Ideal for industrial applications requiring a compact chip carrier package with 44 terminals.

Median Price

$42.440

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,980 parts In-Stock

1+ parts

$42.440

100+ parts

$39.890

1k+ parts

$37.350

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2,980

$42.440

$39.890

$37.350

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$5.730

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100

$5.730

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Digiode

USA . 2,682 parts In-Stock

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$22.230

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2,682

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Vyrian

USA . 5,226 parts In-Stock

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Anansix

USA . 933 parts In-Stock

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Connector Distribution Corp

USA . 127 parts In-Stock

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127

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Right Parts Inc.

USA . 127 parts In-Stock

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Cyclops Electronics Ltd

UK . 24 parts In-Stock

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ECAB

Sweden . 14 parts In-Stock

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Bristol Electronics

USA . 5 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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Semi Source

USA . 2 parts In-Stock

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Prism Electronics

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Vigor

Singapore . 344 parts In-Stock

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$5.490

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344

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Continental Prestige Electronics

USA . 2,446 parts In-Stock

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$5.730

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$5.615

2,446

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$5.615

Netroflash

USA . 100 parts In-Stock

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$5.730

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100

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Ampacity Inc.

Singapore . 5,047 parts In-Stock

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$19.890

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Corphita

USA . 4,133 parts In-Stock

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$21.060

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UNI Independent Distributors

Spain . 5,702 parts In-Stock

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Argo Parts USA

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Futuretech Components

Singapore . 1,445 parts In-Stock

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Assy Fe

Spain . 1,008 parts In-Stock

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Perfect Parts

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Overview

Discover the power of the P87C52SFAA microcontroller from NXP Semiconductors, a leader in cutting-edge technology. This versatile chip offers a wide range of applications, providing customers with unparalleled performance and reliability. With its advanced features and high-quality design, the P87C52SFAA delivers exceptional value and benefits to users looking for a dependable solution for their projects. Upgrade your systems with this top-of-the-line microcontroller and experience the difference in efficiency and effectiveness today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the package, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 5.5 V

Can handle a maximum supply voltage of 5.5 V, allowing for flexibility in power supply options and compatibility with different systems.

Address Bus Width: 16

A wider address bus width of 16 allows for increased memory addressing capabilities, enabling the microcontroller to handle larger data sets.

Package Shape: SQUARE

Square package shape simplifies PCB layout and design, optimizing space utilization and enhancing overall system aesthetics.

Bit Size: 8

8-bit architecture provides a good balance between cost, performance, and power consumption, making it suitable for a wide range of embedded applications.

Power Supplies (V): 3/5

Supports multiple power supply options (3V and 5V), offering flexibility in system design and compatibility with various peripheral devices.

No. of Terminals: 44

With 44 terminals, it can accommodate a wide range of input and output connections, making it versatile for different types of interface requirements.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers high reliability, good thermal performance, and ease of handling during assembly and rework processes.

Minimum Supply Voltage: 2.7 V

Can operate at a minimum supply voltage of 2.7 V, allowing for lower power consumption and extending battery life in portable applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance in demanding industrial environments with elevated temperature conditions.

CPU Family: 8051

8051 CPU family is a proven and widely-used architecture with a rich ecosystem of development tools and resources, making it easy to design and program.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C enables usage in extreme cold environments without affecting the performance and reliability of the microcontroller.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections for long-term operation.

Terminal Position: QUAD

Quad terminal position enables easy and secure mounting onto the PCB, enhancing mechanical stability and simplifying the assembly process.

ROM Words: 8192

Large ROM capacity of 8192 words allows for storing program code and data, supporting complex algorithms and multi-tasking applications.

Maximum Seated Height: 4.57 mm

Low maximum seated height of 4.57 mm minimizes the overall profile of the package, enabling compact designs and reduced PCB stack height.

Width: 16.585 mm

Narrow width of 16.585 mm saves PCB space, facilitating dense and miniaturized designs for applications with size constraints.

External Data Bus Width: 8

8-bit external data bus width allows for efficient data transfer between the microcontroller and external memory or peripherals, supporting high-speed communication.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16 MHz provides fast processing speed, enabling quick execution of instructions and responsive system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds, ensuring reliable solder joints and robust thermal cycling performance during assembly.

Peak Reflow Temperature °C: 245

High peak reflow temperature of 245°C supports lead-free soldering processes, complying with environmental regulations and industry standards.

Length: 16.585 mm

Compact length of 16.585 mm helps in achieving a space-efficient layout on the PCB, contributing to overall system miniaturization.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions, making it suitable for rugged industrial applications.

Peripheral IC Type: MICROCONTROLLER

Built-in peripherals and specialized hardware features make it a powerful microcontroller for a wide range of applications, reducing the need for additional components.

RAM Bytes: 256

256 bytes of RAM provide temporary storage for data and variables, supporting efficient data processing and multitasking capabilities in embedded systems.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, making the microcontroller energy-efficient and suitable for battery-powered devices.

Terminal Form: J BEND

J bend terminal form ensures secure and reliable solder connections, enhancing the mechanical strength and electrical performance of the package.

Maximum Supply Current: 15 mA

Low maximum supply current of 15 mA results in lower power consumption and reduced heat dissipation, contributing to energy-efficient operation.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5 V offers compatibility with standard power sources and ensures stable operation of the microcontroller under normal operating conditions.

ROM Programmability: OTPROM

One-time programmable ROM eliminates the need for external memory devices, reducing system complexity and lowering overall cost of the product.

Terminal Pitch: 1.27 mm

Fine terminal pitch of 1.27 mm allows for high-density mounting on the PCB, enabling compact designs and efficient use of available board space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller is moisture sensitive, requiring proper handling and storage to prevent damage during assembly and soldering processes.

Speed: 16 rpm

High-speed operation at 16 rpm enables quick data processing and efficient execution of tasks, making it suitable for applications requiring fast response times.

No. of I/O Lines: 32

With 32 I/O lines, it offers ample connectivity options for interfacing with external devices and sensors, enhancing the versatility and functionality of the microcontroller.

Technical Specifications

Microcontrollers P87C52SFAA attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.585 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Peripheral IC Type:

Trade Compliance

P87C52SFAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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