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P87C51MB2BA/02

NXP Semiconductors

P87C51MB2BA/02 by NXP Semiconductors

NXP Semiconductors' P87C51MB2BA/02 microcontroller features 8-bit CPU, 23-bit address bus, and 24 MHz clock frequency. Ideal for commercial applications, it offers 2048 bytes of RAM, OTPROM ROM programmability, and 34 I/O lines for versatile connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Digiode

USA . 3,933 parts In-Stock

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Vyrian

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Anansix

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Nova Conductors

Japan . 54 parts In-Stock

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LWI Electronics Inc

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One Stop Electronics

USA . 412 parts In-Stock

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Corohmni

South Africa . 75 parts In-Stock

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UNI Independent Distributors

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Argo Parts USA

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Corphita

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Aranea Global

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Overview

Unlock the potential of your electronic devices with the P87C51MB2BA/02 microcontroller from NXP Semiconductors. Designed with precision and reliability, this chip provides seamless integration and exceptional performance for a wide range of applications. Whether you're working on smart home devices, industrial automation, or automotive systems, this microcontroller delivers the power and efficiency you need to bring your projects to life. Trust in NXP Semiconductors to provide top-notch quality and innovative solutions that exceed expectations. Elevate your designs with the P87C51MB2BA/02 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and thermal stability, making the product resistant to external factors.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

Can operate efficiently even at high supply voltages, providing flexibility in power supply options.

Address Bus Width: 23

Wide address bus width allows for a large memory address space, enabling the microcontroller to handle complex programs and data.

Package Shape: SQUARE

Square package shape ensures uniform distribution of components, optimizing space utilization on the PCB.

Bit Size: 8

8-bit processing capability is suitable for a wide range of applications, offering a good balance between performance and cost.

Power Supplies (V): 3/5

Supports multiple power supply options, enabling compatibility with different voltage requirements in various systems.

No. of Terminals: 44

Sufficient number of terminals for interfacing with external components and peripherals, enhancing connectivity options.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers protection to the internal components and simplifies PCB layout design.

Minimum Supply Voltage: 4.5 V

Can operate at low supply voltages, conserving power and extending battery life in portable devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures reliability and stability in harsh environmental conditions.

CPU Family: 8051

Part of a well-established and widely-used CPU family, ensuring compatibility with existing software and development tools.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature range allows the microcontroller to function in cold environments without performance degradation.

Terminal Finish: TIN

Tin terminal finish provides corrosion resistance and solderability, ensuring long-term reliability and ease of assembly.

Terminal Position: QUAD

Quad terminal position offers a secure connection to the PCB, reducing the risk of signal loss or disconnection.

ROM Words: 65536

Large ROM capacity allows for storing a vast amount of program code, enabling the microcontroller to support complex applications.

Maximum Seated Height: 4.57 mm

Low maximum seated height minimizes the overall profile of the package, facilitating compact and slim device designs.

Width: 16.5862 mm

Optimal width dimension for efficient PCB layout and component placement, enhancing overall system integration.

External Data Bus Width: 8

8-bit external data bus width enables fast data transfer between the microcontroller and external peripherals, improving system performance.

Maximum Clock Frequency: 24 MHz

High maximum clock frequency provides fast processing speed, making the microcontroller suitable for real-time applications.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures proper solder joint formation during assembly, enhancing manufacturing reliability.

Length: 16.5862 mm

Optimal length dimension for compact and space-efficient PCB designs, allowing for versatile placement in various devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade is suitable for standard operating environments, offering reliability and performance in typical consumer applications.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller with dedicated peripherals, providing enhanced functionality and control capabilities in embedded systems.

RAM Bytes: 2048

Adequate RAM capacity for temporary data storage and processing, supporting multitasking and data manipulation in real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and reliability in diverse applications.

Terminal Form: J BEND

J Bend terminal form facilitates easy soldering and strong mechanical connections, improving the overall reliability of the package.

Maximum Supply Current: 71.8 mA

Moderate maximum supply current allows for efficient power management and minimizes energy consumption in operation.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage compatibility with most electronic systems, ensuring broad applicability and ease of integration.

PWM Channels: YES

PWM channels enable precise control of connected devices, supporting applications that require accurate modulation and signal generation.

ROM Programmability: OTPROM

One-time programmable ROM ensures secure and permanent storage of firmware code, protecting intellectual property and preventing unauthorized access.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy PCB mounting and soldering, promoting efficient assembly and reliability.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture exposure, requiring standard handling precautions during storage and assembly.

Speed: 24 rpm

High processing speed of 24 rotations per minute ensures rapid data computation and response time in time-critical applications.

No. of I/O Lines: 34

Abundant I/O lines for interfacing with external devices and sensors, enabling versatile connectivity options and system expansion.

Technical Specifications

Microcontrollers P87C51MB2BA/02 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

23

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.5862 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

71.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

P87C51MB2BA/02 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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