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P87C52SFBB,557

NXP Semiconductors

P87C52SFBB,557 by NXP Semiconductors

P87C52SFBB,557 by NXP Semiconductors is an 8-bit microcontroller ideal for industrial applications. It features a -40 °C to 85 °C operating temp range, 8192 ROM words, and operates on 3/5V power supplies. Its compact flatpack design ensures efficient surface mounting.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 11,774 parts In-Stock

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Anansix

USA . 2,113 parts In-Stock

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Digiode

USA . 1,972 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 87 parts In-Stock

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One Stop Electronics

USA . 475 parts In-Stock

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$6.000

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Microchip USA

USA . 167 parts In-Stock

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$7.296

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AZTECH Wire

Italy . 1,058 parts In-Stock

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$18.080

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Corphita

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UNI Independent Distributors

Spain . 4,240 parts In-Stock

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Perfect Parts

USA . 2,800 parts In-Stock

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Overview

Unlock superior performance with the P87C52SFBB,557 microcontroller from NXP Semiconductors. Renowned for quality and innovation, NXP empowers your projects with reliable, high-performance solutions. This versatile microcontroller is perfect for industrial applications, offering robust temperature resilience and efficient power use. Experience enhanced reliability, reduced development time, and comprehensive support, ensuring your designs stand out in a competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and ease of integration into modern electronic circuits, leading to reduced space requirements.

Package Shape: SQUARE

The square package shape provides a balanced layout, which can improve thermal performance and simplifies PCB design.

Bit Size: 8

An 8-bit architecture is perfect for cost-sensitive applications that require moderate processing power, optimizing performance for simpler tasks.

Power Supplies (V): 3/5

Dual voltage supply options (3V and 5V) offer versatility in power source selection, enhancing compatibility with various systems.

No. of Terminals: 44

With 44 terminals, this microcontroller provides ample I/O ports for interfacing with other components, allowing for complex applications.

Package Style (Meter): FLATPACK

The flatpack style ensures a low profile on PCBs, which is beneficial for space-constrained designs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows for reliable performance in demanding industrial environments.

CPU Family: 8051

Being based on the widely used 8051 CPU family ensures strong community support and extensive documentation, making it easier to implement in projects.

Minimum Operating Temperature: -40 °C

The capability to operate in temperatures as low as -40 °C indicates suitability for harsh climate applications, enhancing reliability.

Terminal Finish: TIN

The tin terminal finish provides good solderability and is resistant to oxidation, ensuring strong connections and long-term reliability.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing on PCBs, leading to lower trace inductance and better signal integrity.

ROM Words: 8192

With 8192 words of ROM, this microcontroller provides sufficient program storage for a range of applications without compromising on size or complexity.

Maximum Time At Peak Reflow Temperature: 30 s

At a peak reflow temperature of 260 °C for up to 30 seconds, the microcontroller can endure the soldering process while ensuring integrity.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature demonstrates compatibility with both lead-free and traditional soldering methods, increasing manufacturing flexibility.

Temperature Grade: INDUSTRIAL

Industrial temperature grading enhances reliability for use in demanding environments often found in manufacturing and automation.

RAM Bytes: 256

With 256 bytes of RAM, this microcontroller can efficiently handle basic data manipulation tasks while maintaining low power consumption.

Technology: CMOS

CMOS technology contributes to lower power consumption, making the microcontroller ideal for battery-operated devices and energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminal forms enhance soldering efficiency and reliability, aiding in consistent performance in assembled electronics.

Maximum Supply Current: 0.075 mA

With a maximum supply current of only 0.075 mA, this microcontroller is exceptionally power-efficient, extending battery life in portable applications.

ROM Programmability: UVPROM

UVPROM programmability allows for reusability and flexibility in coding, empowering developers to easily update software configurations.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is beneficial for high-density PCB designs, making it suitable for modern compact electronics.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, suggesting a need for controlled handling and storage to ensure longevity and reliability.

Speed: 16 rpm

At a speed of 16 rpm, this microcontroller is well-suited for applications that require predictable performance in data processing and control tasks.

Technical Specifications

Microcontrollers P87C52SFBB,557 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

Bit Size:

8

CPU Family:

8051

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.5SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

UVPROM

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.075 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

P87C52SFBB,557 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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