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P80C552EFA/08,518

NXP Semiconductors

P80C552EFA/08,518 by NXP Semiconductors

P80C552EFA/08,518 by NXP Semiconductors is an 8-bit microcontroller with a clock frequency of 16 MHz. It features 48 I/O lines and PWM channels for industrial applications. With a supply voltage range of 4.5V to 5.5V, it operates in temperatures from -40°C to 85°C, making it suitable for various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,767 parts In-Stock

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Digiode

USA . 3,933 parts In-Stock

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3,933

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Anansix

USA . 247 parts In-Stock

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247

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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100

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 999 parts In-Stock

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$3.000

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$3.000

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AZTECH Wire

Italy . 719 parts In-Stock

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$4.907

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One Stop Electronics

USA . 1,066 parts In-Stock

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$25.000

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Microchip USA

USA . 462 parts In-Stock

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$29.440

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462

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$29.440

Perfect Parts

USA . 82,992 parts In-Stock

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Corphita

USA . 1,942 parts In-Stock

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UNI Independent Distributors

Spain . 1,512 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Unlock endless possibilities with the P80C552EFA/08,518 by NXP Semiconductors. As a leading manufacturer in the industry, NXP guarantees top-notch quality and reliability. This microcontroller is perfect for a wide range of applications, offering unmatched performance and efficiency. With its advanced features and high-speed capabilities, the P80C552EFA/08,518 delivers exceptional value to customers, making it the ideal choice for all your electronic design needs. Experience innovation at its finest with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good mechanical strength and electrical insulation, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy PCB assembly, reducing production time and costs.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources.

Address Bus Width: 16

With a 16-bit address bus width, the microcontroller can access a larger memory space, enabling it to handle more complex tasks.

Package Shape: SQUARE

Square package shape facilitates easy mounting and placement on the PCB, optimizing space utilization.

Bit Size: 8

8-bit architecture allows for efficient processing of data in smaller chunks, ideal for applications with moderate computational requirements.

No. of Terminals: 68

Having 68 terminals provides ample I/O options for connecting external devices and peripherals, enhancing the versatility of the microcontroller.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers a compact form factor, making the microcontroller suitable for space-constrained applications.

Minimum Supply Voltage: 4.5 V

Support for a minimum supply voltage of 4.5V ensures reliable operation even under low-power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance of 85°C allows the microcontroller to function reliably in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature rating of -40°C ensures the microcontroller can operate in extreme cold environments without performance degradation.

Terminal Finish: TIN

Tin terminal finish offers excellent solderability, enhancing the ease of PCB assembly and improving overall reliability.

ADC Channels: YES

Integrated ADC channels enable analog input capabilities, allowing the microcontroller to interface with various sensors and signal sources.

Terminal Position: QUAD

Quad terminal positioning facilitates easier soldering and connection of external components, simplifying the PCB assembly process.

Maximum Seated Height: 4.57 mm

Low maximum seated height enables the microcontroller to fit in compact electronic devices with limited vertical space.

Width: 24.23 mm

24.23mm width offers a balance between compactness and accessibility, making the microcontroller suitable for a wide range of PCB layouts.

External Data Bus Width: 8

With an 8-bit external data bus width, the microcontroller can efficiently transmit and receive data in 8-bit chunks, enhancing data processing speed.

Maximum Clock Frequency: 16 MHz

Support for a high maximum clock frequency of 16MHz enables fast data processing and high-speed performance in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring robust solder connections during PCB assembly.

Peak Reflow Temperature °C: 245

Can handle peak reflow temperature of 245°C during soldering process, maintaining structural integrity and reliability.

Length: 24.23 mm

24.23mm length provides a balanced form factor, making the microcontroller versatile for various PCB designs and layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments with wide temperature variations.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it offers integrated peripherals and processing capabilities, reducing the need for external components and simplifying system design.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: J BEND

J bend terminal form offers secure connections and reliable solder joints, enhancing the durability of the microcontroller in various operating conditions.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V ensures compatibility with standard power sources, making the microcontroller easy to integrate into existing systems.

PWM Channels: YES

Support for PWM channels allows for precise control of analog signals, making the microcontroller suitable for motor control and power management applications.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27mm offers convenient spacing for soldering and PCB layout, making the microcontroller suitable for automated assembly processes.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling procedures during PCB assembly and storage.

Speed: 16 rpm

16 rpm speed rating denotes the maximum clock speed of the microcontroller, indicating its processing capabilities and performance in real-time applications.

No. of I/O Lines: 48

With 48 I/O lines, the microcontroller offers ample connectivity options for interfacing with external devices and peripherals, enhancing its versatility and functionality.

Technical Specifications

Microcontrollers P80C552EFA/08,518 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e3

Length:

24.23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Maximum Seated Height:

4.57 mm

Speed:

16 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Peripheral IC Type:

Trade Compliance

P80C552EFA/08,518 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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