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P80C552EBA/08,512

NXP Semiconductors

P80C552EBA/08,512 by NXP Semiconductors

NXP Semiconductors P80C552EBA/08,512 is an 8051 microcontroller with 8-bit CPU, 16 MHz clock frequency, and 256 bytes of RAM. It features ADC and PWM channels for versatile applications in commercial-grade microcontroller projects requiring up to 5.5V supply voltage.

Median Price

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Lifecycle Status

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Vyrian

USA . 4,430 parts In-Stock

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Digiode

USA . 3,208 parts In-Stock

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Nova Conductors

Japan . 800 parts In-Stock

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800

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Anansix

USA . 488 parts In-Stock

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ComSIT Distribution GmbH

Germany . 11 parts In-Stock

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ComSIT USA

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J2 Sourcing AB

Sweden . 3 parts In-Stock

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Bristol Electronics

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AZTECH Wire

Italy . 592 parts In-Stock

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$5.159

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Semicontronic

India . 660 parts In-Stock

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$21.450

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Ampacity Inc.

Singapore . 282 parts In-Stock

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$29.000

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One Stop Electronics

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Corohmni

South Africa . 247 parts In-Stock

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Microchip USA

USA . 124 parts In-Stock

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Aztec Data Supply Inc.

USA . 247 parts In-Stock

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UNI Independent Distributors

Spain . 7,698 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,072 parts In-Stock

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Futuretech Components

Singapore . 6,000 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Argo Parts USA

USA . 1,580 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Perfect Parts

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Advanced Electronics

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Overview

Elevate your projects with the high-quality P80C552EBA/08,512 microcontroller by NXP Semiconductors. With its advanced technology and reliable performance, this chip is perfect for a wide range of applications. From industrial automation to consumer electronics, this versatile product offers unparalleled value and benefits to customers. Trust NXP Semiconductors to deliver top-notch components that will take your designs to the next level. Choose innovation, choose NXP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and resistance to moisture and chemicals, making the product reliable in various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly of the microcontroller onto circuit boards, saving time and space.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can handle higher power requirements and voltage fluctuations without damage.

Address Bus Width: 16

A wider address bus width of 16 bits allows for larger memory addressing capabilities, enabling the microcontroller to handle more complex tasks efficiently.

Package Shape: SQUARE

The square package shape provides uniformity in design and makes it easier to place the microcontroller on the circuit board securely.

Bit Size: 8

An 8-bit microcontroller is suitable for handling a wide range of applications, from simple to moderately complex tasks, making it versatile for different projects.

Power Supplies (V): 5

The 5V power supply is a common voltage level in many electronic systems, ensuring compatibility with various components and power sources.

No. of Terminals: 68

Having 68 terminals provides ample connectivity options for interfacing with external devices and peripherals, increasing the microcontroller's versatility.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal conductivity and efficient heat dissipation, enhancing the overall performance and reliability of the microcontroller.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V allows for flexibility in power input options while ensuring stable operation of the microcontroller within specified voltage ranges.

Technical Specifications

Microcontrollers P80C552EBA/08,512 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e3

Length:

24.2316 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

256

Maximum Seated Height:

4.57 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

45 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.2316 mm

Peripheral IC Type:

Trade Compliance

P80C552EBA/08,512 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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