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P80C32SBAA,112

NXP Semiconductors

P80C32SBAA,112 by NXP Semiconductors

P80C32SBAA,112 by NXP Semiconductors is an 8-bit microcontroller with an 8-bit external data bus width and a 16-bit address bus width. It comes in a square chip carrier package style with 44 terminals and is designed for applications requiring a CMOS technology-based peripheral IC type microcontroller.

Median Price

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Lifecycle Status

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4

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1k+

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Digiode

USA . 1,873 parts In-Stock

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Anansix

USA . 1,160 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Vyrian

USA . 272 parts In-Stock

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AZTECH Wire

Italy . 238 parts In-Stock

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$10.358

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One Stop Electronics

USA . 165 parts In-Stock

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$18.000

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Ampacity Inc.

Singapore . 689 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,743 parts In-Stock

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$73.628

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Corohmni

South Africa . 203 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

USA . 3,499 parts In-Stock

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Aranea Global

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Corphita

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UNI Independent Distributors

Spain . 145 parts In-Stock

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Overview

Unlock the power of innovation with the P80C32SBAA,112 microcontroller from NXP Semiconductors. As a leader in the industry, NXP delivers top-quality products that exceed expectations. Ideal for a wide range of applications, this microcontroller offers unmatched value and benefits to customers. Experience seamless performance and reliability with the P80C32SBAA,112, providing endless possibilities for your next project. Let NXP Semiconductors elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and enabling automated assembly processes.

Address Bus Width: 16

A wider address bus width allows for larger memory address spaces, enabling the microcontroller to handle more complex processing tasks efficiently.

Package Shape: SQUARE

The square package shape helps in efficient placement and alignment on circuit boards, optimizing space utilization in electronic designs.

Bit Size: 8

An 8-bit size allows for faster data processing and handling of smaller data sets, making the microcontroller suitable for various embedded applications.

No. of Terminals: 44

With 44 terminals, this microcontroller offers a sufficient number of connections for interfacing with external components, sensors, and peripherals.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers protection and ease of handling, making it suitable for applications where reliability and compactness are essential.

Terminal Position: QUAD

The quad terminal position allows for easier connection and soldering of the microcontroller onto a circuit board, ensuring secure and stable connections.

Maximum Seated Height: 4.57 mm

The low seated height allows for compact designs and enables the microcontroller to be used in space-constrained applications without sacrificing performance.

Width: 16.5862 mm

The compact width of the microcontroller makes it suitable for small electronic devices, IoT applications, and other space-limited designs.

External Data Bus Width: 8

An external data bus width of 8 bits allows for efficient data transfer between the microcontroller and external memory or peripherals, enhancing overall system performance.

Length: 16.5862 mm

The short length of the microcontroller contributes to its compact form factor, making it an ideal choice for applications where size constraints are crucial.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates a processor, memory, and I/O peripherals on a single chip, offering a cost-effective and space-saving solution for embedded systems.

Technology: CMOS

The CMOS technology used in this microcontroller ensures low power consumption, high noise immunity, and reliable operation, making it suitable for battery-powered and energy-efficient applications.

Terminal Form: J BEND

The J bend terminal form facilitates easy soldering and assembly onto a PCB, ensuring secure connections and reliable performance in electronic devices.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and spaced-out connections, enabling easier soldering and reducing the risk of short circuits or electrical interference.

No. of I/O Lines: 32

With 32 I/O lines, this microcontroller can interface with a wide range of external devices and peripherals, providing flexibility and scalability for diverse applications.

Technical Specifications

Microcontrollers P80C32SBAA,112 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

16

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of I/O Lines:

32

No. of Terminals:

44

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

4.57 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

P80C32SBAA,112 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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