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P5020NSN1VNB

NXP Semiconductors

P5020NSN1VNB by NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;

Median Price

$288.120

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

P5020NSN1VNB by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 124 parts In-Stock

1+ parts

$177.060

100+ parts

-

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124

$177.060

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Rochester

USA . 3 parts In-Stock

1+ parts

$399.180

100+ parts

$375.230

1k+ parts

$351.280

10k+ parts

-

3

$399.180

$375.230

$351.280

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,585 parts In-Stock

1+ parts

$441.418

100+ parts

-

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1,585

$441.418

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Vyrian

USA . 2,265 parts In-Stock

1+ parts

-

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2,265

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Anansix

USA . 1,898 parts In-Stock

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1,898

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Chip Stock

USA . 133 parts In-Stock

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133

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$63.883

100+ parts

$58.134

1k+ parts

$52.384

10k+ parts

-

5,000

$63.883

$58.134

$52.384

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Corphita

USA . 3,408 parts In-Stock

1+ parts

$418.185

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3,408

$418.185

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Microchip USA

USA . 223 parts In-Stock

1+ parts

$484.569

100+ parts

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223

$484.569

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A-Z Elektronik GmbH

Germany . 5,963 parts In-Stock

1+ parts

-

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5,963

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QUARKTWIN TECHNOLOGY LTD

USA . 3,198 parts In-Stock

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3,198

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UNI Independent Distributors

Spain . 2,710 parts In-Stock

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2,710

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Vigor

Singapore . 861 parts In-Stock

1+ parts

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1k+ parts

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861

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Technical Specifications

Microprocessors P5020NSN1VNB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

166 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1295

JESD-609 Code:

e1

Length:

37.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.53 mm

Speed:

2000 rpm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

37.5 mm

Peripheral IC Type:

Trade Compliance

P5020NSN1VNB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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