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NX3V1G66GW-G

NXP Semiconductors

NX3V1G66GW-G by NXP Semiconductors

NX3V1G66GW-G by NXP Semiconductors is a CMOS SPST switch designed for automotive applications. It features a max operating temp of 125 °C, operates at 1.5/3.3V, and has an on-state resistance of just 2.1Ω, ensuring efficient performance in compact designs. Its small outline package allows for easy surface mounting in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,218 parts In-Stock

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4,218

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Vyrian

USA . 3,273 parts In-Stock

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3,273

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Anansix

USA . 2,847 parts In-Stock

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2,847

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,208 parts In-Stock

1+ parts

$6.500

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$6.500

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UNI Independent Distributors

Spain . 3,375 parts In-Stock

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Corphita

USA . 3,322 parts In-Stock

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3,322

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Overview

Elevate your designs with the NX3V1G66GW-G from NXP Semiconductors, a high-performance multiplexer that guarantees reliability and efficiency for automotive applications. With its robust build and excellent temperature range, this component enhances signal integrity while minimizing power consumption. Trust in NXP's legacy of innovation to deliver exceptional quality, ensuring your projects achieve optimal performance and longevity. Experience the benefits of cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and longevity in various environments.

Surface Mount: YES

Surface mount feature allows for space-saving integration on printed circuit boards, making it ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space and facilitates easier placement on motherboard layouts.

Power Supplies (V): 1.5/3.3

Dual power supply options support a wide range of applications and systems, enhancing versatility.

No. of Terminals: 5

With five terminals, the product provides adequate connectivity for various configurations and applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This packaging style is ideal for applications where space is at a premium, allowing for high-density layouts.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this product suitable for demanding environments and automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures increases reliability in extreme conditions, broadening application scope.

Terminal Position: DUAL

Dual terminal positioning enhances PCB layout flexibility and design adaptability.

Other IC type: SPST

The SPST configuration is versatile for various switching applications, making it a practical choice.

Maximum On-state Resistance (Ron): 2.1 ohm

A low on-state resistance minimizes power loss and improves energy efficiency in circuits.

Maximum Switch-on Time: 42 ns

Fast switch-on time supports high-speed applications, ensuring efficient performance in time-sensitive tasks.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, this component meets stringent quality and reliability standards for vehicle applications.

Technology: CMOS

CMOS technology typically provides lower power consumption and higher noise immunity, making it suitable for modern electronic designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable electrical connections in surface mount technology.

Terminal Pitch: 0.635 mm

A fine terminal pitch allows for close placement of components, optimizing PCB real estate.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make action prevents short circuits by ensuring a clean switch between states, enhancing operational safety.

Technical Specifications

Multiplexers & Switches NX3V1G66GW-G attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G5

Normal Position (V):

NO

No. of Functions:

1

No. of Terminals:

5

Maximum On-state Resistance (Ron):

2.1 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.5/3.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

42 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

NX3V1G66GW-G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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