Loading...

NX3V1G66GM-H

NXP Semiconductors

NX3V1G66GM-H by NXP Semiconductors

NX3V1G66GM-H by NXP Semiconductors is a CMOS SPST switch designed for automotive applications. It operates at 1.5/3.3V with a max on-state resistance of 2.1Ω and can handle temperatures from -40 °C to 125 °C. Its compact design features a no-lead, surface-mount package for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,754 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,754

-

-

-

-

Digiode

USA . 2,182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,182

-

-

-

-

Vyrian

USA . 2,165 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,165

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,573 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,573

$3.500

-

-

-

UNI Independent Distributors

Spain . 2,731 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,731

-

-

-

-

Corphita

USA . 1,927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,927

-

-

-

-

Overview

Unlock your design potential with the NX3V1G66GM-H from NXP Semiconductors, a trusted leader in innovative solutions. This high-quality multiplexer offers exceptional reliability and performance for diverse applications, from automotive to consumer electronics. With its compact size and low on-state resistance, it ensures efficient power management and seamless connectivity. Choose NX3V1G66GM-H for a superior blend of quality, versatility, and value that empowers your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making the product suitable for automotive applications.

Surface Mount: YES

Surface mount configuration allows for a compact design and is ideal for high-density circuit layouts.

Package Shape: RECTANGULAR

Rectangular packaging provides efficient space utilization on PCBs, making integration into various designs easier.

Power Supplies: 1.5/3.3V

Supports dual voltage operation, making it versatile for different electronic designs and applications.

No. of Terminals: 6

A six-terminal configuration allows for multiple switching options, catering to a range of circuit requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in reducing the overall footprint of devices, making it suitable for compact applications.

Maximum Operating Temperature: 125 °C

Operation at higher temperatures ensures reliability in harsh environments, essential for automotive components.

Minimum Operating Temperature: -40 °C

The ability to operate in extremely low temperatures ensures functionality in diverse climates, suitable for outdoor and automotive use.

Terminal Position: DUAL

Dual terminal position enhances layout flexibility and facilitates easier routing on printed circuit boards.

Other IC Type: SPST

Single Pole Single Throw (SPST) configuration simplifies design, making it easier for engineers to implement.

Maximum On-state Resistance (Ron): 2.1 ohm

Low on-state resistance leads to reduced power loss, improving overall efficiency of the circuit.

Maximum Switch-on Time: 42 ns

Fast switching times enhance system performance, vital for high-speed applications.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, ensuring compliance with industry standards and reliability.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making it suitable for battery-operated devices.

Terminal Form: NO LEAD

No lead configuration allows for a cleaner design and aids in meeting environmental standards.

Terminal Pitch: 0.5 mm

A smaller terminal pitch allows for a higher density of connections, ideal for modern compact electronic devices.

Switching: BREAK-BEFORE-MAKE

The break-before-make switching guarantees that signals do not overlap during transitions, reducing the risk of short circuits.

Technical Specifications

Multiplexers & Switches NX3V1G66GM-H attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N6

Normal Position (V):

NO

No. of Functions:

1

No. of Terminals:

6

Maximum On-state Resistance (Ron):

2.1 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.5/3.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

42 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

NX3V1G66GM-H Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19