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NX3V1G66GM-G

NXP Semiconductors

NX3V1G66GM-G by NXP Semiconductors

NX3V1G66GM-G by NXP Semiconductors is a compact SPST switch designed for automotive applications. It operates at 1.5/3.3V with a max on-state resistance of 2.1Ω and can handle temperatures from -40 °C to 125 °C. Ideal for space-constrained environments, it features a fast switch-on time of 42ns.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,442 parts In-Stock

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Anansix

USA . 1,578 parts In-Stock

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1,578

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Vyrian

USA . 261 parts In-Stock

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261

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Distributors (Availability)

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One Stop Electronics

USA . 669 parts In-Stock

1+ parts

$3.500

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669

$3.500

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UNI Independent Distributors

Spain . 5,928 parts In-Stock

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5,928

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Corphita

USA . 2,459 parts In-Stock

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2,459

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Overview

Unlock unparalleled performance with the NX3V1G66GM-G from NXP Semiconductors. Renowned for its quality and innovation, NXP delivers a versatile SPST switch crafted for automotive applications, ensuring reliability in extreme conditions. With minimal resistance and swift switching times, this compact solution enhances your designs while maximizing efficiency. Elevate your projects with a trusted partner committed to excellence—experience the NXP difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and lightweight properties, making it suitable for a variety of electronic applications.

Surface Mount: YES

Surface mount capability allows for high-density PCB layouts and improved performance in automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape helps in efficient space utilization on printed circuit boards, facilitating compact device designs.

Power Supplies (V): 1.5/3.3

Dual voltage operation enhances compatibility with a wide range of electronic systems and applications.

No. of Terminals: 6

Six terminals provide suitable connection options for various configurations, making it versatile for different circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained environments, ensuring that the product fits in compact designs.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows the product to function reliably in harsh environments, enhancing its application range.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product is suitable for applications in extreme cold conditions, making it ideal for automotive use.

Terminal Position: DUAL

Dual terminal position adds flexibility in PCB design and enhances circuit layout efficiency.

Other IC type: SPST

Being a single-pole single-throw (SPST) switch makes it a straightforward choice for basic switching applications.

Maximum On-state Resistance (Ron): 2.1 ohm

Low on-state resistance minimizes power loss and increases efficiency in power-sensitive applications.

Maximum Switch-on Time: 42 ns

Fast switch-on time ensures rapid response in high-speed applications, making it suitable for modern digital circuits.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, ensuring reliability and safety in automotive environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: NO LEAD

No lead design reduces the environmental impact, complying with RoHS standards and facilitating modern manufacturing processes.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is optimal for high-density PCB layouts, allowing for more compact designs without sacrificing performance.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching configuration prevents short circuits during operation, ensuring safe and reliable switching.

Technical Specifications

Multiplexers & Switches NX3V1G66GM-G attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N6

Normal Position (V):

NO

No. of Functions:

1

No. of Terminals:

6

Maximum On-state Resistance (Ron):

2.1 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.5/3.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

42 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

NX3V1G66GM-G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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