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NX3L4053PW-Q100J

NXP Semiconductors

NX3L4053PW-Q100J by NXP Semiconductors

NX3L4053PW-Q100J by NXP is a CMOS SPDT multiplexer designed for automotive applications, featuring a max operating temp of 125 °C and AEC-Q100 screening. It offers 3 functions with a low on-state resistance of 4.2Ω and operates b/w 1.4V to 4.3V. Its compact SOIC package ensures efficient surface mounting in space-constrained designs.

Median Price

$0.952

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,353 parts In-Stock

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-

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$0.934

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$0.775

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$0.691

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$0.934

$0.775

$0.691

Verical

USA . 1,353 parts In-Stock

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$0.969

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$0.864

1,353

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$0.969

$0.864

Distributors (In-Stock)

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Digiode

USA . 4,609 parts In-Stock

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$0.604

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4,609

$0.604

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Flip Electronics

USA . 12,500 parts In-Stock

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12,500

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Vyrian

USA . 5,782 parts In-Stock

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Anansix

USA . 517 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,341 parts In-Stock

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$0.540

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$0.540

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Corphita

USA . 4,251 parts In-Stock

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$0.572

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Vigor

Singapore . 187 parts In-Stock

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$0.917

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Microchip USA

USA . 3,462 parts In-Stock

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$4.295

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AZTECH Wire

Italy . 970 parts In-Stock

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$19.360

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UNI Independent Distributors

Spain . 6,662 parts In-Stock

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Overview

Unlock seamless connectivity with the NX3L4053PW-Q100J from NXP Semiconductors, a leader in quality and innovation. This versatile multiplexer offers exceptional performance for automotive applications, ensuring reliability even in extreme temperatures. With its compact design and robust features, it maximizes efficiency while minimizing signal loss. Trust in NXP's unparalleled expertise to elevate your projects, delivering value that drives success in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures the reliability and longevity of the product under various conditions.

Surface Mount: YES

Surface mount technology allows for efficient manufacturing and minimizes the footprint of the device on the PCB.

No. of Functions: 3

Having three functions increases versatility, allowing designers to implement multiple switching requirements in one device.

Screening Level: AEC-Q100

This compliance with AEC-Q100 ensures the product meets the rigorous standards required for automotive applications, enhancing reliability.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on the PCB, making it suitable for compact designs.

Power Supplies (V): 1.4/4.3

Wide input voltage range allows for flexible design applications across various electronic systems.

No. of Terminals: 16

With 16 terminals, it provides ample connection points for durable and secure device integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile contribute to enhanced space-saving qualities and improved layout efficiency on PCBs.

Maximum Operating Temperature: 125 °C

This high maximum operating temperature rating ensures the product can function in demanding environments.

Minimum Operating Temperature: -40 °C

The capability to operate in extreme cold temperatures makes it ideal for outdoor and harsh environmental applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes enhance conductivity and reduce corrosion, ensuring reliable and long-lasting connections.

Terminal Position: DUAL

The dual terminal position design improves layout flexibility and optimizes the integration with other components.

Output (V): SEPARATE OUTPUT

Separate outputs allow for independent signal control, which enhances design flexibility and functionality.

Other IC type: SPDT

The Single Pole Double Throw (SPDT) configuration is ideal for applications requiring efficient signal routing.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, it ensures compatibility with lead-free soldering processes.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance allows for high-reliability assembly processes without compromising the device integrity.

Maximum On-state Resistance (Ron): 4.2 ohm

Low on-state resistance contributes to minimized power loss and efficient signal transmission.

Maximum Switch-on Time: 90 ns

Fast switch-on time of 90 ns facilitates high-speed applications, providing rapid response capabilities.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product exhibits enhanced durability and reliability in high-stress environments.

Technology: CMOS

The CMOS technology provides low power consumption and high scalability, making it suitable for modern electronics.

Terminal Form: GULL WING

The gull wing terminal form enhances solder joint reliability and facilitates easier assembly on PCBs.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch allows for higher density packaging without compromising the integrity of connections.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make configuration prevents short circuits during switching, ensuring device safety and reliability.

Technical Specifications

Multiplexers & Switches NX3L4053PW-Q100J attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

16

Maximum On-state Resistance (Ron):

4.2 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4/4.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

90 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NX3L4053PW-Q100J Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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