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NX3L2T384GM,125

NXP Semiconductors

NX3L2T384GM,125 by NXP Semiconductors

NX3L2T384GM,125 from NXP Semiconductors is a CMOS SPDT switch with a max operating temp of 125 °C and low on-state resistance of 1.7Ω. It operates b/w 1.4V to 4.3V, making it ideal for automotive applications. Its compact design ensures efficient space utilization in circuits.

Median Price

$0.396

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.396

1k+ parts

$0.329

10k+ parts

$0.293

500

-

$0.396

$0.329

$0.293

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,329 parts In-Stock

1+ parts

$0.309

100+ parts

-

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3,329

$0.309

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Vyrian

USA . 8,479 parts In-Stock

1+ parts

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8,479

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ACDS - Activité Composants Distribution Service

France . 4,000 parts In-Stock

1+ parts

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4,000

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Anansix

USA . 2,759 parts In-Stock

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2,759

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 635 parts In-Stock

1+ parts

$0.292

100+ parts

-

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635

$0.292

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Component Stockers USA

USA . 6,038 parts In-Stock

1+ parts

$0.330

100+ parts

$0.310

1k+ parts

$0.280

10k+ parts

-

6,038

$0.330

$0.310

$0.280

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Microchip USA

USA . 200 parts In-Stock

1+ parts

$0.464

100+ parts

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200

$0.464

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AZTECH Wire

Italy . 799 parts In-Stock

1+ parts

$11.060

100+ parts

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799

$11.060

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Perfect Parts

USA . 8,960 parts In-Stock

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8,960

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QUARKTWIN TECHNOLOGY LTD

USA . 5,805 parts In-Stock

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5,805

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UNI Independent Distributors

Spain . 4,559 parts In-Stock

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4,559

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Cyclops Electronics Ltd (Excess)

UK . 4,000 parts In-Stock

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4,000

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Overview

Elevate your projects with the NX3L2T384GM,125 from NXP Semiconductors, a trusted name in innovative technology. This high-performance multiplexer delivers unmatched reliability and efficiency in compact applications, perfect for automotive and advanced electronics. Its low power consumption and impressive thermal range ensure optimal operation under demanding conditions, making it an ideal choice for engineers seeking quality and performance without compromise. Choose NXP for cutting-edge solutions that drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection, making the product reliable for various applications.

Surface Mount: YES

Surface mount compatibility enables easier integration into compact designs, enhancing performance in space-constrained applications.

No. of Functions: 2

The dual function capability allows for greater flexibility and efficiency in circuit design, reducing the need for multiple components.

Package Shape: SQUARE

The square package shape facilitates optimal use of board space and easy alignment during assembly.

Nominal Supply Voltage (Vsup): 1.65 V

Operating at a low nominal supply voltage increases energy efficiency and is suitable for battery-powered devices.

Power Supplies (V): 1.4/4.3

This wide power supply range allows for versatile application in different electronic environments.

No. of Terminals: 8

The 8 terminals provide sufficient connectivity options for various configurations, enhancing the product's utility.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile ensures a compact solution, ideal for modern electronics with stringent space requirements.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to function reliably in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures reliability in extreme conditions, suitable for automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish improves electrical connectivity and enhances longevity against corrosion.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing and minimizes board space usage.

Maximum Seated Height: 0.5 mm

A maximum seated height of only 0.5 mm minimizes profile, further enhancing integration in compact designs.

Width: 1.6 mm

The narrow width enables a lightweight and small footprint, beneficial for densely packed circuits.

Other IC type: SPDT

SPDT configuration offers versatility in switching applications, making it a perfect choice for complex circuits.

Minimum Supply Voltage (Vsup): 1.4 V

Low minimum supply voltage capability allows operation in low-power applications, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard soldering processes in production, facilitating easier manufacturing.

Peak Reflow Temperature (°C): 260

Supports high reflow temperatures, ensuring reliable solder joints and robust connections during assembly.

Maximum On-state Resistance (Ron): 1.7 ohm

Low on-state resistance minimizes power loss during operation, increasing efficiency in switching applications.

Maximum Switch-on Time: 120 ns

Fast switch-on time allows for high-speed applications, ideal for digital circuits requiring rapid response.

Length: 1.6 mm

Compact length ensures compatibility with tight layouts and aids in efficient use of PCB real estate.

Maximum Switch-off Time: 60 ns

A quick switch-off time enhances performance in high-speed applications, reducing latency in signal processing.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications ensures reliability in harsh environments, making it suitable for vehicle electronics.

Technology: CMOS

CMOS technology enables low power consumption while maintaining high-speed performance, ideal for modern applications.

Terminal Form: NO LEAD

No-lead terminal design aids in minimizing the footprint while improving thermal and electrical performance.

Terminal Pitch: 0.5 mm

The fine terminal pitch supports high-density designs, making it ideal for compact electronic devices.

Maximum Supply Voltage (Vsup): 4.3 V

The ability to handle a maximum supply voltage of 4.3 V expands application possibilities in various circuits.

Nominal Off-state Isolation: 90 dB

High off-state isolation enhances signal integrity and minimizes crosstalk, crucial for high-performance applications.

Nominal On-state Resistance Match: 0.04 ohm

Exceptional resistance match improves performance consistency across different channels, ensuring reliable operation.

Technical Specifications

Multiplexers & Switches NX3L2T384GM,125 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N8

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

8

Nominal Off-state Isolation:

90 dB

Nominal On-state Resistance Match:

.04 ohm

Maximum On-state Resistance (Ron):

1.7 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4/4.3

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Maximum Switch-off Time:

60 ns

Maximum Switch-on Time:

120 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

NX3L2T384GM,125 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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