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NX3L2G384GT,115

NXP Semiconductors

NX3L2G384GT,115 by NXP Semiconductors

The NXP Semiconductors NX3L2G384GT,115 is a CMOS dual-function multiplexer with 8 terminals and on-state resistance of 4.1 ohm. It operates at temperatures ranging from -40 to 125 °C and has separate output voltage levels of 1.5/3.3V, making it ideal for automotive applications requiring fast switching times (41 ns) in a small outline package.

Median Price

$0.365

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

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$0.365

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Flip Electronics

USA . 35,000 parts In-Stock

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Vyrian

USA . 6,953 parts In-Stock

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Digiode

USA . 4,985 parts In-Stock

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Anansix

USA . 1,978 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 849 parts In-Stock

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$0.270

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849

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Ampacity Inc.

Singapore . 205 parts In-Stock

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$0.500

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205

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Microchip USA

USA . 457 parts In-Stock

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$2.071

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457

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One Stop Electronics

USA . 491 parts In-Stock

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$5.500

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AZTECH Wire

Italy . 831 parts In-Stock

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$5.956

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Component Stockers USA

USA . 220 parts In-Stock

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$99.990

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Corphita

USA . 3,210 parts In-Stock

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UNI Independent Distributors

Spain . 2,571 parts In-Stock

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Perfect Parts

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Overview

Unlock new possibilities with the NX3L2G384GT,115 by NXP Semiconductors. This high-quality multiplexer offers seamless switching between functions, making it perfect for a wide range of applications. With NXP's reputation for excellence, you can trust in the reliability and durability of this product. Say goodbye to limitations and hello to enhanced performance with the NX3L2G384GT,115. Elevate your projects and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight construction, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

No. of Functions: 2

Having 2 functions in one device provides versatility and flexibility in system design and operation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold conditions without affecting functionality.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it an efficient choice for multiplexers and switches.

Technical Specifications

Multiplexers & Switches NX3L2G384GT,115 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NC

No. of Functions:

2

No. of Terminals:

8

Maximum On-state Resistance (Ron):

4.1 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

41 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NX3L2G384GT,115 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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