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NX3L2267GU-Q100X

NXP Semiconductors

NX3L2267GU-Q100X by NXP Semiconductors

NX3L2267GU-Q100X by NXP Semiconductors is a CMOS SPDT multiplexer designed for automotive applications. It features a max operating temp of 125 °C, 4.1Ω on-state resistance, and operates b/w 1.4V to 4.3V. Ideal for compact, reliable switching in harsh environments.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,859 parts In-Stock

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Digiode

USA . 4,665 parts In-Stock

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Anansix

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One Stop Electronics

USA . 1,173 parts In-Stock

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$1.500

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AZTECH Wire

Italy . 787 parts In-Stock

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Microchip USA

USA . 424 parts In-Stock

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$25.729

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$21.678

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Component Stockers USA

USA . 398 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

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Corphita

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Overview

Elevate your projects with the NX3L2267GU-Q100X from NXP Semiconductors—where quality meets innovation. This versatile multiplexer excels in automotive applications, ensuring reliability in extreme temperatures. With its low on-state resistance and rapid switching capabilities, it streamlines circuit designs while enhancing performance. Trust in NXP's expertise to deliver exceptional value, efficiency, and durability for your next cutting-edge solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern circuit boards.

No. of Functions: 2

With two functions, this multiplexer/switch enhances versatility in circuit designs, accommodating multiple signal routing needs.

Screening Level: AEC-Q100

Being AEC-Q100 qualified ensures that the product meets the high-quality standards required for automotive applications.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space management on PCBs, providing a straightforward layout.

Power Supplies (V): 1.4/4.3

The wide voltage supply range enables compatibility with various systems, facilitating flexible design options.

No. of Terminals: 10

Having ten terminals provides ample connectivity, which is essential for complex circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier style enables easy mounting on PCBs, promoting quick production and assembly processes.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows for reliable performance in demanding environments, enhancing durability.

Minimum Operating Temperature: -40 °C

The ability to operate at extreme low temperatures makes this product suitable for applications in harsh climates.

Terminal Position: QUAD

Quad terminal positioning supports efficient routing of signals, optimizing layout design and reducing parasitic effects.

Output (V): SEPARATE OUTPUT

Separate outputs provide flexibility in signal routing, allowing for more control in circuit operations.

Other IC type: SPDT

The SPDT configuration enables single-pole double-throw switching, enhancing functionality in various applications.

Maximum On-state Resistance (Ron): 4.1 ohm

Low on-state resistance minimizes power losses and heat generation, resulting in enhanced efficiency.

Maximum Switch-on Time: 90 ns

Fast switching time improves the overall speed of signal processing, vital for high-speed applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product is built to withstand rigorous conditions and guarantees reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: NO LEAD

No lead design enhances the product's compatibility with lead-free soldering processes, promoting environmental sustainability.

Terminal Pitch: 0.4 mm

The small terminal pitch supports denser circuit designs, allowing for more components in limited space.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching ensures that only one output is active at a time, preventing short circuits and improving safety.

Technical Specifications

Multiplexers & Switches NX3L2267GU-Q100X attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N10

No. of Functions:

2

No. of Terminals:

10

Maximum On-state Resistance (Ron):

4.1 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC10,.06X.07,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.4/4.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

90 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Trade Compliance

NX3L2267GU-Q100X Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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